Specification	RD3L07BATTL1

Current - Continuous Drain (Id) @ 25°C	70 A
Drain to Source Voltage (Vdss)	60 V
Drive Voltage (Max Rds On, Min Rds On)	10 V, 4.5 V
FET Type	P-Channel
Gate Charge (Qg) (Max) @ Vgs	105 nC
Input Capacitance (Ciss) (Max) @ Vds	6700 pF
Mounting Type	Surface Mount
Operating Temperature	150 °C
Package / Case	SC-63, DPAK (2 Leads + Tab), TO-252-3
Power Dissipation (Max) [Max]	101 W
Rds On (Max) @ Id, Vgs	12.7 mOhm
Supplier Device Package	TO-252
Technology	MOSFET (Metal Oxide)
Vgs (Max)	20 V
Vgs(th) (Max) @ Id [Max]	2.5 V

RD3L07BAT Series

Pch -60V -70A, TO-252 (DPAK), Power MOSFET

Part	FET Type	Package / Case	Rds On (Max) @ Id, Vgs	Drive Voltage (Max Rds On, Min Rds On)	Mounting Type	Technology	Gate Charge (Qg) (Max) @ Vgs	Vgs (Max)	Supplier Device Package	Power Dissipation (Max) [Max]	Current - Continuous Drain (Id) @ 25°C	Drain to Source Voltage (Vdss)	Vgs(th) (Max) @ Id [Max]	Operating Temperature	Input Capacitance (Ciss) (Max) @ Vds
Rohm Semiconductor RD3L07BATTL1	P-Channel	DPAK (2 Leads + Tab) SC-63 TO-252-3	12.7 mOhm	4.5 V 10 V	Surface Mount	MOSFET (Metal Oxide)	105 nC	20 V	TO-252	101 W	70 A	60 V	2.5 V	150 °C	6700 pF

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Cut Tape (CT)	1	$ 3.11
		10	$ 2.02
		100	$ 1.40
		500	$ 1.13
		1000	$ 1.05
	Digi-Reel®	1	$ 3.11
		10	$ 2.02
		100	$ 1.40
		500	$ 1.13
		1000	$ 1.05
	Tape & Reel (TR)	2500	$ 0.96
Newark	Each (Supplied on Cut Tape)	1	$ 2.37
		10	$ 1.81
		25	$ 1.64
		50	$ 1.48
		100	$ 1.31
		250	$ 1.20
		500	$ 1.08

Description

General part information

RD3L07BAT Series

RD3L07BAT is a low on-resistance power MOSFET suitable for switching applications.

Documents

Technical documentation and resources

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Types and Features of Transistors

Application Note

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

About Flammability of Materials

Environmental Data

Reliability Test Result

Manufacturing Data

What is a Thermal Model? (Transistor)

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Part Explanation

Application Note

RD3L07BATTL1

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RD3L07BATTL1

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Technical Specifications

RD3L07BAT Series

Pricing

Description

RD3L07BAT Series

Documents

About Export Regulations

How to Use LTspice&reg; Models: Tips for Improving Convergence

RD3L07BAT ESD Data

Importance of Probe Calibration When Measuring Power: Deskew

MOSFET Gate Drive Current Setting for Motor Driving

Notes for Temperature Measurement Using Thermocouples

Package Dimensions

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

List of Transistor Package Thermal Resistance

Moisture Sensitivity Level - Transistors

Two-Resistor Model for Thermal Simulation

RD3L07BAT Data Sheet

Report of SVHC under REACH Regulation

PCB Layout Thermal Design Guide

What Is Thermal Design

Method for Monitoring Switching Waveform

Temperature derating method for Safe Operating Area (SOA)

Explanation for Marking

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Types and Features of Transistors

Measurement Method and Usage of Thermal Resistance RthJC

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

About Flammability of Materials

Reliability Test Result

What is a Thermal Model? (Transistor)

Impedance Characteristics of Bypass Capacitor

Part Explanation

RD3L07BAT Series

How to Use LTspice® Models: Tips for Improving Convergence