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Technical Specifications
Parameters and characteristics for this part
| Specification | SPF080-1X08-998Z |
|---|---|
| Contact Finish - Mating | Tin-Lead |
| Contact Finish Thickness - Mating | 5.08 µm |
| Contact Finish Thickness - Mating | 200 µin |
| Features | Closed Frame |
| Mounting Type | Through Hole |
| Number of Positions or Pins (Grid) | 8 |
| Number of Positions or Pins (Grid) [x] | 1 |
| Number of Positions or Pins (Grid) [y] | 8 |
| Pitch - Mating | 0.1 " |
| Pitch - Mating | 2.54 mm |
| Type | SIP |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | N/A | 0 | $ 0.00 | |
Description
General part information
SPF080 Series
8 (1 x 8) Pos SIP Socket Tin-Lead Through Hole
Documents
Technical documentation and resources
No documents available