Specification	FSA4159P6X

-3db Bandwidth	180 MHz
Channel Capacitance (CS(off), CD(off)) [custom]	12 pF
Channel Capacitance (CS(off), CD(off)) [custom]	12 pF
Channel-to-Channel Matching (ΔRon)	50 mOhm
Charge Injection	15 pC
Crosstalk	-60 dB
Current - Leakage (IS(off)) (Max)	10 nA
Mounting Type	Surface Mount
Multiplexer/Demultiplexer Circuit	2:1
Number of Circuits	1
On-State Resistance (Max) [Max]	900 mOhm
Operating Temperature [Max]	85 °C
Operating Temperature [Min]	-40 °C
Package / Case	6-TSSOP, SC-88, SOT-363
Supplier Device Package	SC-88 (SC-70-6)
Switch Circuit	SPDT
Switch Time (Ton, Toff) (Max) [custom]	20 ns
Switch Time (Ton, Toff) (Max) [custom]	30 ns
Voltage - Supply, Single (V+) [Max]	5.5 V
Voltage - Supply, Single (V+) [Min]	1.65 V

FSA4159 Series

Low Voltage, 1Ω, SPDT Analog Switch with Power-Off Isolation

Part	Current - Leakage (IS(off)) (Max)	Number of Circuits	Channel Capacitance (CS(off), CD(off)) [custom]	Channel Capacitance (CS(off), CD(off)) [custom]	Mounting Type	Channel-to-Channel Matching (ΔRon)	Supplier Device Package	Operating Temperature [Max]	Operating Temperature [Min]	Multiplexer/Demultiplexer Circuit	Voltage - Supply, Single (V+) [Min]	Voltage - Supply, Single (V+) [Max]	Package / Case	On-State Resistance (Max) [Max]	Charge Injection	Crosstalk	Switch Circuit	Switch Time (Ton, Toff) (Max) [custom]	Switch Time (Ton, Toff) (Max) [custom]	-3db Bandwidth
ON Semiconductor FSA4159P6X	10 nA	1	12 pF	12 pF	Surface Mount	50 mOhm	SC-88 (SC-70-6)	85 °C	-40 °C	2:1	1.65 V	5.5 V	6-TSSOP SC-88 SOT-363	900 mOhm	15 pC	-60 dB	SPDT	20 ns	30 ns	180 MHz

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

ON Semiconductor	N/A	1	$ 0.22

Description

General part information

FSA4159 Series

The FSA4159 is a high-performance Single-Pole / Double-Throw (SPDT) analog switch. The device features ultra-low RONof 1Ω at 4.5V VCCand operates over the wide VCCrange of 1.65V to 5.50V. The device is fabricated with sub-micron CMOS technology to achieve fast switching speeds and is designed for break-before- make operation.