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24-SIP LGA
Power Supplies - Board Mount

MAXM17546ALY#

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Analog Devices Inc./Maxim Integrated

4.5V TO 42V, 5A HIGH-EFFICIENCY, DC-DC STEP-DOWN POWER MODULE WITH INTEGRATED INDUCTOR

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24-SIP LGA
Power Supplies - Board Mount

MAXM17546ALY#

Active
Analog Devices Inc./Maxim Integrated

4.5V TO 42V, 5A HIGH-EFFICIENCY, DC-DC STEP-DOWN POWER MODULE WITH INTEGRATED INDUCTOR

Technical Specifications

Parameters and characteristics for this part

SpecificationMAXM17546ALY#
Mounting TypeSurface Mount
Operating Temperature [Max]125 °C
Operating Temperature [Min]-40 C
Package / Case29-PowerBLGA Module
Supplier Device Package29-SIP LGA (9x15)
Voltage - Input (Max) [Max]42 V
Voltage - Input (Min) [Min]4.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 120$ 25.30
Tray 1$ 27.00
10$ 20.01
25$ 18.22
80$ 16.50
230$ 15.34
440$ 15.25

Description

General part information

MAXM17546 Series

The Himalaya series of voltage regulator ICs and power modules enable cooler, smaller and simpler power supply solutions. The MAXM17546 is an easy-to-use, step-down power module that combines a switching power supply controller, dual n-channel MOSFET power switches, fully shielded inductor, and the compensation components in a low-profile, thermally-efficient system-in-package (SiP).The device operates over a wide input voltage range of 4.5V to 42V and delivers up to 5A continuous output current with excellent line and load regulation over an output-voltage range of 0.9V to 12V. The high level of integration significantly reduces design complexity, manufacturing risks, and offers a true plug-and-play power supply solution, reducing time-to-market.The device can be operated in the pulse-width modulation (PWM), pulse-frequency modulation (PFM), or discontinuous conduction mode (DCM) control schemes.The MAXM17546 is available in a low-profile, highly thermal-emissive, compact, 29-pin, 9mm x 15mm x 4.32mm SiP package that reduces power dissipation in the package and enhances efficiency. The package is easily soldered onto a printed circuit board and suitable for automated circuit board assembly.ApplicationsBase-Station Point-of-Load RegulatorDistributed Supply RegulationFPGA and DSP Point-of-Load RegulatorHVAC and Building ControlTest and Measurement Equipment