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RXH070N03TB1
Discrete Semiconductor Products

SH8ME5TB1

Active
Rohm Semiconductor

MOSFET, N & P-CH, 100V, 4.5A, SOP ROHS COMPLIANT: YES

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RXH070N03TB1
Discrete Semiconductor Products

SH8ME5TB1

Active
Rohm Semiconductor

MOSFET, N & P-CH, 100V, 4.5A, SOP ROHS COMPLIANT: YES

Technical Specifications

Parameters and characteristics for this part

SpecificationSH8ME5TB1
Current - Continuous Drain (Id) @ 25°C4.5 A
Drain to Source Voltage (Vdss)100 V
Gate Charge (Qg) (Max) @ Vgs6.7 nC, 52 nC
Input Capacitance (Ciss) (Max) @ Vds2100 pF, 305 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / Case0.154 in
Package / Case8-SOIC
Package / Case3.9 mm
Power - Max [Max]2 W
Rds On (Max) @ Id, Vgs91 mOhm, 58 mOhm
Supplier Device Package8-SOP
TechnologyMOSFET (Metal Oxide)
Vgs(th) (Max) @ Id2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 2.45
10$ 1.66
100$ 1.17
500$ 0.91
1000$ 0.90
Digi-Reel® 1$ 2.45
10$ 1.66
100$ 1.17
500$ 0.91
1000$ 0.90
N/A 1001$ 2.18
Tape & Reel (TR) 2500$ 0.78
5000$ 0.77
NewarkEach (Supplied on Cut Tape) 1$ 2.50
10$ 1.76
25$ 1.58
50$ 1.41
100$ 1.24
250$ 1.11
500$ 0.99
1000$ 0.92

Description

General part information

SH8ME5 Series

SH8ME5 is a low on-resistance MOSFET ideal for switching applications. This product includes two 100V MOSFETs in a small surface mount package (SOP8).

Documents

Technical documentation and resources

Datasheet

Datasheet

Moisture Sensitivity Level - Transistors

Package Information

SH8ME5 ESD Data

Characteristics Data

Package Dimensions

Package Information

PCB Layout Thermal Design Guide

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Explanation for Marking

Package Information

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Compliance of the RoHS directive

Environmental Data

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

P-channel Power MOSFETs selection guide

Technical Article

About Flammability of Materials

Environmental Data

Method for Monitoring Switching Waveform

Schematic Design & Verification

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Part Explanation

Application Note

List of Transistor Package Thermal Resistance

Thermal Design

What is a Thermal Model? (Transistor)

Thermal Design

About Export Regulations

Export Information

SOP8 Dual Cu Inner Structure

Package Information

How to Use LTspice® Models

Schematic Design & Verification

Two-Resistor Model for Thermal Simulation

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Condition of Soldering / Land Pattern Reference

Package Information

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Anti-Whisker formation - Transistors

Package Information

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

What Is Thermal Design

Thermal Design

Taping Information

Package Information

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Types and Features of Transistors

Application Note

Certificate of not containing SVHC under REACH Regulation

Environmental Data