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ROHM DTC023YUBTL
Discrete Semiconductor Products

2SCR502UBTL

Active
Rohm Semiconductor

NPN, SOT-323FL, 30V 0.5A, DRIVER TRANSISTOR

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ROHM DTC023YUBTL
Discrete Semiconductor Products

2SCR502UBTL

Active
Rohm Semiconductor

NPN, SOT-323FL, 30V 0.5A, DRIVER TRANSISTOR

Technical Specifications

Parameters and characteristics for this part

Specification2SCR502UBTL
Current - Collector (Ic) (Max) [Max]500 mA
Current - Collector Cutoff (Max) [Max]200 nA
DC Current Gain (hFE) (Min) @ Ic, Vce [Min]200
Frequency - Transition360 MHz
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseSC-85
Power - Max [Max]200 mW
Supplier Device PackageUMT3F
Transistor TypeNPN
Vce Saturation (Max) @ Ib, Ic300 mV
Voltage - Collector Emitter Breakdown (Max) [Max]30 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.24
10$ 0.15
100$ 0.09
500$ 0.07
1000$ 0.06
Digi-Reel® 1$ 0.24
10$ 0.15
100$ 0.09
500$ 0.07
1000$ 0.06
N/A 1036$ 0.24
Tape & Reel (TR) 3000$ 0.05
NewarkEach (Supplied on Cut Tape) 1$ 0.24
10$ 0.15
25$ 0.12
50$ 0.09
100$ 0.06
250$ 0.06
500$ 0.06
1000$ 0.05

Description

General part information

2SCR502 Series

Various products are available in lineup developed focusing on energy-saving and high reliability as main concepts, covering from ultra-compact packages to power-packages to meet the needs in market.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

What Is Thermal Design

Thermal Design

Inner Structure

Package Information

Package Dimensions

Package Information

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

How to Use LTspice® Models

Schematic Design & Verification

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Part Explanation

Application Note

Types and Features of Transistors

Application Note

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Explanation for Marking

Package Information

How to Create Symbols for PSpice Models

Models

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

ESD Data

Characteristics Data

About Export Regulations

Export Information

Reliability Test Result

Manufacturing Data

Anti-Whisker formation - Transistors

Package Information

2SCR502UB Data Sheet

Data Sheet

Two-Resistor Model for Thermal Simulation

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

List of Transistor Package Thermal Resistance

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Compliance of the RoHS directive

Environmental Data

Certificate of not containing SVHC under REACH Regulation

Environmental Data

What is a Thermal Model? (Transistor)

Thermal Design

Taping Information

Package Information

PCB Layout Thermal Design Guide

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

About Flammability of Materials

Environmental Data

Moisture Sensitivity Level - Transistors

Package Information

Notes for Temperature Measurement Using Thermocouples

Thermal Design

UMT3 Part Marking

Related Document

UMT3 T106 Taping Spec

Datasheet