Integrated Circuits (ICs)

ZSSC3230BI1B

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WAFER UNSAWN, 304

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Integrated Circuits (ICs)

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WAFER UNSAWN, 304

Technical Specifications

Parameters and characteristics for this part

Part	Type	Input Type	Operating Temperature [Min]	Operating Temperature [Max]	Supplier Device Package	Output Type	Current - Supply	Mounting Type	Package / Case	Resolution	Supplied Contents	Contents	Function
Renesas Electronics Corporation ZSSC3230BC3R	Capacitive Sensor	Analog Digital	-40 ¯C 0 °C	70 °C 85 C	24-VFQFPN (4x4)	I2C Serial	1.1 mA	Surface Mount	24-VFQFN Exposed Pad
Renesas Electronics Corporation ZSSC3230BI1B	Capacitive Sensor	Analog Digital	-40 °C	125 °C	Die	I2C Serial	1.1 mA	Surface Mount	Die
Renesas Electronics Corporation ZSSC3230BI3R	Capacitive Sensor	Analog Digital	-40 °C	125 °C	24-VFQFPN (4x4)	I2C Serial	1.1 mA	Surface Mount	24-VFQFN Exposed Pad
Renesas Electronics Corporation ZSSC3230BI3W			-40 C	125 °C	24-VFQFPN (4x4)			Surface Mount	24-VFQFN Exposed Pad	14 b
Renesas Electronics Corporation ZSSC3230KIT	Interface										Board(s)	Board(s)	Sensor Signal Conditioner

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General part information

WAFER UNSAWN, 304

Technical documentation and resources