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ROHM DAN222ZMT2L
Discrete Semiconductor Products

BAV199UMTL

Active
Rohm Semiconductor

SMALL SIGNAL DIODE, DUAL SERIES, 100 V, 125 MA, 1.25 V, 3 ΜS, 4 A

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ROHM DAN222ZMT2L
Discrete Semiconductor Products

BAV199UMTL

Active
Rohm Semiconductor

SMALL SIGNAL DIODE, DUAL SERIES, 100 V, 125 MA, 1.25 V, 3 ΜS, 4 A

Technical Specifications

Parameters and characteristics for this part

SpecificationBAV199UMTL
Current - Average Rectified (Io) (per Diode)215 mA (DC)
Current - Reverse Leakage @ Vr5 nA
Diode Configuration1 Pair Series Connection
GradeAutomotive
Mounting TypeSurface Mount
Operating Temperature - Junction150 ¯C
Package / CaseSC-85
QualificationAEC-Q101
Reverse Recovery Time (trr)3 çs
Speed [Min]200 mA, 500 ns
Supplier Device PackageUMD3F
TechnologyStandard
Voltage - DC Reverse (Vr) (Max) [Max]80 V
Voltage - Forward (Vf) (Max) @ If1.25 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 749$ 0.33

Description

General part information

BAV199UM Series

BAV199UM is high reliability and low IRdiodes for general switching.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

About Flammability of Materials

Environmental Data

Anti-Whisker formation - Diodes

Package Information

About Export Regulations

Export Information

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

How to Use LTspice® Models

Schematic Design & Verification

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Package Dimensions

Package Information

How to Create Symbols for PSpice Models

Models

Method for Monitoring Switching Waveform

Schematic Design & Verification

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Notes for Calculating Power Consumption:Static Operation

Thermal Design

What is a Thermal Model? (Diode)

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Reliability Test Result

Manufacturing Data

Taping Information

Package Information

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Inner Structure

Package Information

Moisture Sensitivity Level - Diodes

Package Information

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Compliance of the RoHS directive

Environmental Data

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

Two-Resistor Model for Thermal Simulation

Thermal Design

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Diode Types and Applications

Technical Article

What Is Thermal Design

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Explanation for Marking

Package Information

List of Diode Package Thermal Resistance

Thermal Design

Power Loss and Thermal Design of Diodes

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Part Explanation

Application Note

BAV199UM Data Sheet

Data Sheet

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article