Integrated Circuits (ICs)

MC33FS8430G1ES

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SYSTEM BASIS CHIP FS8430

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Integrated Circuits (ICs)

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SYSTEM BASIS CHIP FS8430

Technical Specifications

Parameters and characteristics for this part

Specification	MC33FS8430G1ES

Applications	System Basis Chip
Current - Supply	15 mA
Mounting Type	Wettable Flank, Surface Mount
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-40 °C
Package / Case	56-VFQFN Exposed Pad
Supplier Device Package	56-HVQFN (8x8)
Voltage - Supply	60 VDC

Part	Mounting Type	Supplier Device Package	Package / Case	Applications	Current - Supply	Voltage - Supply	Operating Temperature [Min]	Operating Temperature [Max]
Freescale Semiconductor - NXP MC33FS8430G2ES
Freescale Semiconductor - NXP MC33FS8430G1ESR2
Freescale Semiconductor - NXP MC33FS8430G2ESR2
Freescale Semiconductor - NXP MC33FS8430G0ESR2	Surface Mount Wettable Flank	56-HVQFN (8x8)	56-VFQFN Exposed Pad
Freescale Semiconductor - NXP MC33FS8430G4ES
Freescale Semiconductor - NXP MC33FS8430G1ES	Surface Mount Wettable Flank	56-HVQFN (8x8)	56-VFQFN Exposed Pad	System Basis Chip	15 mA	60 VDC	-40 °C	125 °C
Freescale Semiconductor - NXP MC33FS8430G0ES	Surface Mount Wettable Flank	56-HVQFN (8x8)	56-VFQFN Exposed Pad	System Basis Chip	15 mA	60 VDC	-40 °C	125 °C
Freescale Semiconductor - NXP MC33FS8430G4ESR2

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

System Basis Chip PMIC 56-HVQFN (8x8)

Technical documentation and resources