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VSON-CLIP (DMC)
Integrated Circuits (ICs)

CSD95491Q5MCT

NRND
Texas Instruments

20 V 60 A SON 5 X 6 MM DUALCOOL SYNCHRONOUS BUCK NEXFET™ POWER STAGE

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VSON-CLIP (DMC)
Integrated Circuits (ICs)

CSD95491Q5MCT

NRND
Texas Instruments

20 V 60 A SON 5 X 6 MM DUALCOOL SYNCHRONOUS BUCK NEXFET™ POWER STAGE

Technical Specifications

Parameters and characteristics for this part

SpecificationCSD95491Q5MCT
ApplicationsSynchronous Buck Converters
Current - Output / Channel60 A
Fault ProtectionShoot-Through
FeaturesBootstrap Circuit
InterfacePWM
Load TypeCapacitive, Inductive
Mounting TypeSurface Mount
Operating Temperature [Max]125 ¯C
Operating Temperature [Min]-40 °C
Output ConfigurationHalf Bridge (3)
Package / Case12-PowerTFDFN
Supplier Device Package12-VSON-CLIP (5x6)
TechnologyPower MOSFET
Voltage - Load [Max]16 V
Voltage - Load [Min]4.5 V
Voltage - Supply [Max]5.5 V
Voltage - Supply [Min]4.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 5.45
10$ 4.58
100$ 3.70
Digi-Reel® 1$ 5.45
10$ 4.58
100$ 3.70
Tape & Reel (TR) 250$ 3.50
500$ 3.29
750$ 2.86
1250$ 2.82
2500$ 2.65
Texas InstrumentsSMALL T&R 1$ 4.63
100$ 4.05
250$ 2.84
1000$ 2.29

Description

General part information

CSD95491Q5MC Series

The CSD95491Q5MC NexFET™ power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 5-mm × 6-mm outline package. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.

The CSD95491Q5MC NexFET™ power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 5-mm × 6-mm outline package. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.