CC1354R106T0RGZR
ActiveSIMPLELINK™ ARM® CORTEX®-M33 MULTIBAND WIRELESS MCU WITH 1-MB FLASH AND UP TO 296-KB SRAM
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CC1354R106T0RGZR
ActiveSIMPLELINK™ ARM® CORTEX®-M33 MULTIBAND WIRELESS MCU WITH 1-MB FLASH AND UP TO 296-KB SRAM
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Technical Specifications
Parameters and characteristics for this part
| Specification | CC1354R106T0RGZR |
|---|---|
| Current - Receiving [Max] | 6.9 mA |
| Current - Receiving [Min] | 5.8 mA |
| Current - Transmitting [Max] | 25.8 mA |
| Current - Transmitting [Min] | 7.1 mA |
| Data Rate (Max) | 2 Mbps |
| Frequency [Max] | 2.5 GHz |
| Frequency [Min] | 287 MHz |
| GPIO | 28 |
| Memory Size | 256 kB, 40 kB, 1 MB |
| Modulation | MSK, DSSS, O-QPSK, GFSK |
| Mounting Type | Surface Mount |
| Operating Temperature [Max] | 105 °C |
| Operating Temperature [Min] | -40 °C |
| Package / Case | 48-VFQFN Exposed Pad |
| Power - Output | 5 dBm |
| Protocol | Bluetooth v5.3, Zigbee®, Wireless M-Bus |
| RF Family/Standard | Bluetooth, 802.15.4 |
| Sensitivity | -121 dBm |
| Supplier Device Package | 48-VQFN (7x7) |
| Type | TxRx + MCU |
| Voltage - Supply [Max] | 3.8 V |
| Voltage - Supply [Min] | 1.8 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Cut Tape (CT) | 1 | $ 9.51 | |
| 10 | $ 6.59 | |||
| 25 | $ 5.84 | |||
| 100 | $ 4.99 | |||
| 250 | $ 4.58 | |||
| 500 | $ 4.33 | |||
| 1000 | $ 4.13 | |||
| Digi-Reel® | 1 | $ 9.51 | ||
| 10 | $ 6.59 | |||
| 25 | $ 5.84 | |||
| 100 | $ 4.99 | |||
| 250 | $ 4.58 | |||
| 500 | $ 4.33 | |||
| 1000 | $ 4.13 | |||
| Tape & Reel (TR) | 2500 | $ 4.03 | ||
| Texas Instruments | LARGE T&R | 1 | $ 5.93 | |
| 100 | $ 4.84 | |||
| 250 | $ 3.80 | |||
| 1000 | $ 3.22 | |||
Description
General part information
CC1354R10 Series
The SimpleLink™CC1354R10 device is a multiprotocol and multiband Sub-1GHz and 2.4GHz wireless microcontroller (MCU) supportingThread,Zigbee,Bluetooth 5.3 Low Energy, IEEE 802.15.4g, IPv6-enabled smart objects (6LoWPAN),mioty,Wi-SUN,Amazon Sidewalk,proprietary systems, including the TI 15.4-Stack (Sub-1GHz and 2.4GHz), andconcurrent multiprotocolthrough aDynamic Multiprotocol Manager(DMM) driver. The device is optimized for low-power wireless communications, with advanced security features and on-chip over-the-air (OAD) update capability. It enables long range and reliable communication inbuilding security systems,HVAC,smart meters,medical,wired networking,portable electronics,home theater & entertainment, andconnected peripheralsmarkets. The highlighted features of this device include:
The CC1354R10 device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub-1GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and rich tool set. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more details, seethe SimpleLink MCU platform.
In addition to the software compatibility, within the multiband wireless MCUs, there is pin-to-pin compatibility from 352kB of flash up to 1MB of flash in the 7mm × 7mm QFN package for maximum design scalability. For more information on TI’s Sub-1GHz devices, seewww.ti.com/sub1ghz.
Documents
Technical documentation and resources