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SOT-23 (DBV)
Integrated Circuits (ICs)

SN74AUC1G08DBVR

Active
Texas Instruments

1-CH, 2-INPUT 0.8-V TO 2.7-V ULTRA-HIGH-SPEED (2.4 NS) AND GATE

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Search across all available documentation for this part.

DocumentsSemiconductor Packing Material Electrostatic Discharge (ESD) ProtectionDesign Summary for WCSP Little Logic (Rev. B)+15
SOT-23 (DBV)
Integrated Circuits (ICs)

SN74AUC1G08DBVR

Active
Texas Instruments

1-CH, 2-INPUT 0.8-V TO 2.7-V ULTRA-HIGH-SPEED (2.4 NS) AND GATE

Deep-Dive with AI

DocumentsSemiconductor Packing Material Electrostatic Discharge (ESD) ProtectionDesign Summary for WCSP Little Logic (Rev. B)+15

Technical Specifications

Parameters and characteristics for this part

SpecificationSN74AUC1G08DBVR
Current - Output High, Low [custom]9 mA
Current - Output High, Low [custom]9 mA
Current - Quiescent (Max) [Max]10 µA
Input Logic Level - High [custom]1.7 V
Input Logic Level - Low0.7 V
Logic TypeAND Gate
Max Propagation Delay @ V, Max CL2 ns
Mounting TypeSurface Mount
Number of Circuits1
Number of Inputs2
Operating Temperature [Max]85 °C
Operating Temperature [Min]-40 °C
Package / CaseSC-74A, SOT-753
Supplier Device PackageSOT-23-5
Voltage - Supply [Max]2.7 V
Voltage - Supply [Min]0.8 V

SN74AUC1G08 Series

1-ch, 2-input 0.8-V to 2.7-V ultra-high-speed (2.4 ns) AND gate

PartCurrent - Output High, Low [custom]Current - Output High, Low [custom]Number of CircuitsInput Logic Level - High [custom]Logic TypeInput Logic Level - LowMounting TypeCurrent - Quiescent (Max) [Max]Voltage - Supply [Max]Voltage - Supply [Min]Operating Temperature [Max]Operating Temperature [Min]Max Propagation Delay @ V, Max CLSupplier Device PackageNumber of InputsPackage / CaseSupplier Device Package [x]Supplier Device Package [y]
SC70-5
Texas Instruments
SN74AUC1G08DCKRG4
9 mA
9 mA
1
1.7 V
AND Gate
0.7 V
Surface Mount
10 µA
2.7 V
0.8 V
85 °C
-40 °C
2 ns
SC-70-5
2
5-TSSOP
SC-70-5
SOT-353
SOT-23 (DBV)
Texas Instruments
SN74AUC1G08DBVR
9 mA
9 mA
1
1.7 V
AND Gate
0.7 V
Surface Mount
10 µA
2.7 V
0.8 V
85 °C
-40 °C
2 ns
SOT-23-5
2
SC-74A
SOT-753
5-DSBGA-YZP
Texas Instruments
SN74AUC1G08YEAR
9 mA
9 mA
1
1.7 V
AND Gate
0.7 V
Surface Mount
10 µA
2.7 V
0.8 V
85 °C
-40 °C
2 ns
5-DSBGA
2
5-XFBGA
DSBGA
1.4
0.9
Texas Instruments-LM4041CIM7X-ADJ Voltage References V-Ref Adjustable 1.24V to 10V 12mA 5-Pin SC-70 T/R
Texas Instruments
SN74AUC1G08DCKR
9 mA
9 mA
1
1.7 V
AND Gate
0.7 V
Surface Mount
10 µA
2.7 V
0.8 V
85 °C
-40 °C
2 ns
SC-70-5
2
5-TSSOP
SC-70-5
SOT-353
5 DSBGA
Texas Instruments
SN74AUC1G08YZAR
9 mA
9 mA
1
1.7 V
AND Gate
0.7 V
Surface Mount
10 µA
2.7 V
0.8 V
85 °C
-40 °C
2 ns
5-DSBGA
2
5-XFBGA
DSBGA
1.4
0.9
SOT-5
Texas Instruments
SN74AUC1G08DRLRG4
9 mA
9 mA
1
1.7 V
AND Gate
0.7 V
Surface Mount
10 µA
2.7 V
0.8 V
85 °C
-40 °C
2 ns
SOT-5
2
SOT-553
5-DSBGA-YZP
Texas Instruments
SN74AUC1G08YZPR
9 mA
9 mA
1
1.7 V
AND Gate
0.7 V
Surface Mount
10 µA
2.7 V
0.8 V
85 °C
-40 °C
2 ns
5-DSBGA
2
5-XFBGA
DSBGA
1.4
0.9
SOT-5
Texas Instruments
SN74AUC1G08DRLR
9 mA
9 mA
1
1.7 V
AND Gate
0.7 V
Surface Mount
10 µA
2.7 V
0.8 V
85 °C
-40 °C
2 ns
SOT-5
2
SOT-553
5-DSBGA-YZP
Texas Instruments
SN74AUC1G08YEPR
9 mA
9 mA
1
1.7 V
AND Gate
0.7 V
Surface Mount
10 µA
2.7 V
0.8 V
85 °C
-40 °C
2 ns
5-DSBGA
2
5-XFBGA
DSBGA
1.4
0.9
SN74CBT1G384DGKR
Texas Instruments
SN74AUC1G08DCK3

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.43
10$ 0.37
25$ 0.35
100$ 0.28
250$ 0.26
500$ 0.22
1000$ 0.17
Digi-Reel® 1$ 0.43
10$ 0.37
25$ 0.35
100$ 0.28
250$ 0.26
500$ 0.22
1000$ 0.17
Tape & Reel (TR) 3000$ 0.15
6000$ 0.14
15000$ 0.13
30000$ 0.13
75000$ 0.12
Texas InstrumentsLARGE T&R 1$ 0.28
100$ 0.19
250$ 0.14
1000$ 0.10

Description

General part information

SN74AUC1G08 Series

This single 2-input positive-AND gate is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V VCCoperation.

The SN74AUC1G08 device performs the Boolean function in positive logic.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.