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DFN1616-6W
Discrete Semiconductor Products

RV4E031RPHZGTCR1

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Rohm Semiconductor

PCH -30V -3.1A SMALL SIGNAL MOSFET FOR AUTOMOTIVE

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DFN1616-6W
Discrete Semiconductor Products

RV4E031RPHZGTCR1

Active
Rohm Semiconductor

PCH -30V -3.1A SMALL SIGNAL MOSFET FOR AUTOMOTIVE

Technical Specifications

Parameters and characteristics for this part

SpecificationRV4E031RPHZGTCR1
Drain to Source Voltage (Vdss)30 V
FET TypeP-Channel
Gate Charge (Qg) (Max) @ Vgs [Max]4.8 nC
GradeAutomotive
Input Capacitance (Ciss) (Max) @ Vds460 pF
Mounting TypeWettable Flank, Surface Mount
Operating Temperature [Max]150 °C
Operating Temperature [Min]-55 °C
Package / Case6-PowerWFDFN
Power Dissipation (Max) [Max]1.5 W
QualificationAEC-Q101
Rds On (Max) @ Id, Vgs105 mOhm
Supplier Device PackageDFN1616-6W
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max) @ Id2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 1.22
10$ 0.77
100$ 0.51
500$ 0.39
1000$ 0.36
Digi-Reel® 1$ 1.22
10$ 0.77
100$ 0.51
500$ 0.39
1000$ 0.36
N/A 5601$ 1.22
Tape & Reel (TR) 3000$ 0.26

Description

General part information

RV4E031 Series

RV4E031RPHZG is a ultra-compact automotive-grade MOSFET that provides superior mounting reliability. RV4C020ZPHZG has the electrode height on the side of the package (130μm) required for vehicle applications by utilizing original Wettable Flank formation technology. The result is a consistent solder quality – even for bottom electrode type products – enabling automatic inspection machines to easily verify solder conditions after mounting. It enables greater miniaturization in automotive devices such as ADAS camera modules.

Documents

Technical documentation and resources

About Export Regulations

Export Information

PCB Layout Thermal Design Guide

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

What is a Thermal Model? (Transistor)

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Part Explanation

Application Note

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Notes for Calculating Power Consumption:Static Operation

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Method for Monitoring Switching Waveform

Schematic Design & Verification

Two-Resistor Model for Thermal Simulation

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

List of Transistor Package Thermal Resistance

Thermal Design

About Flammability of Materials

Environmental Data

RV4E031RPHZG Data Sheet

Data Sheet

Notes for Temperature Measurement Using Thermocouples

Thermal Design

How to Use LTspice&reg; Models

Schematic Design & Verification

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

What Is Thermal Design

Thermal Design

Compliance of the RoHS directive

Environmental Data

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Anti-Whisker formation - Transistors

Package Information

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Moisture Sensitivity Level - Transistors

Package Information

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Judgment Criteria of Thermal Evaluation

Thermal Design

Types and Features of Transistors

Application Note

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article