Zenode.ai Logo
Beta
DSBGA (YZP)
Integrated Circuits (ICs)

SN74AUC1G125YZPR

Active
Texas Instruments

BUFFER/LINE DRIVER 1-CH NON-INVERTING 3-ST CMOS 5-PIN DSBGA T/R

Deep-Dive with AI

Search across all available documentation for this part.

DSBGA (YZP)
Integrated Circuits (ICs)

SN74AUC1G125YZPR

Active
Texas Instruments

BUFFER/LINE DRIVER 1-CH NON-INVERTING 3-ST CMOS 5-PIN DSBGA T/R

Technical Specifications

Parameters and characteristics for this part

SpecificationSN74AUC1G125YZPR
Current - Output High, Low [custom]9 mA
Current - Output High, Low [custom]9 mA
Logic TypeBuffer, Non-Inverting
Mounting TypeSurface Mount
Number of Bits per Element1
Number of Elements1
Operating Temperature [Max]85 °C
Operating Temperature [Min]-40 °C
Output Type3-State
Package / CaseDSBGA, 5-XFBGA
Supplier Device Package5-DSBGA
Supplier Device Package [x]1.4
Supplier Device Package [y]0.9
Voltage - Supply [Max]2.7 V
Voltage - Supply [Min]0.8 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.60
10$ 0.53
25$ 0.50
100$ 0.41
250$ 0.38
500$ 0.32
1000$ 0.26
Digi-Reel® 1$ 0.60
10$ 0.53
25$ 0.50
100$ 0.41
250$ 0.38
500$ 0.32
1000$ 0.26
Tape & Reel (TR) 3000$ 0.23
6000$ 0.22
15000$ 0.21
30000$ 0.20
Texas InstrumentsLARGE T&R 1$ 0.46
100$ 0.31
250$ 0.24
1000$ 0.16

Description

General part information

SN74AUC1G125 Series

The SN74AUC1G125 device is a single line driver with a 3-state output. The output is disabled when the output-enable (OE) input is high.

The AUC logic family is specifically designed for speed and is optimized for operation between 1.65-V and 1.95-V VCC. With an optimal supply and 15-pF load the device can operate at over 250 MHz, or 500 Mbps. The unique output structure of the AUC family provides great signal integrity without the need for external termination when driving 50- to 65-Ω transmission lines of moderate length (less than 15 cm). SeeApplication of the Texas Instruments AUC Sub-1-V Little Logic Devicesfor more details on this technology.

This device is available in the popular SOT-23 and SC70 packages, as well as the advanced NanoFree™ DSBGA package. NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.