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SOIC (DW)
Isolators

ISO6760LDWR

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Texas Instruments

INTEGRATED INTERLOCK, 50-MBPS, SIX-CHANNEL (6/0) DIGITAL ISOLATOR

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SOIC (DW)
Isolators

ISO6760LDWR

Active
Texas Instruments

INTEGRATED INTERLOCK, 50-MBPS, SIX-CHANNEL (6/0) DIGITAL ISOLATOR

Technical Specifications

Parameters and characteristics for this part

SpecificationISO6760LDWR
Channel TypeUnidirectional
Common Mode Transient Immunity (Min) [Min]50 kV/çs
Data Rate50 Mbps
Inputs - Side 1/Side 2 [custom]0
Inputs - Side 1/Side 2 [custom]6
Isolated PowerFalse
Mounting TypeSurface Mount
Number of Channels [custom]6
Operating Temperature [Max]125 °C
Operating Temperature [Min]-40 °C
Package / Case16-SOIC
Package / Case [x]0.295 in
Package / Case [y]7.5 mm
Pulse Width Distortion (Max) [Max]7 ns
Rise / Fall Time (Typ) [custom]2.6 ns
Rise / Fall Time (Typ) [custom]2.6 ns
Supplier Device Package16-SOIC
TechnologyCapacitive Coupling
Voltage - Supply [Max]1.89 V, 5.5 V
Voltage - Supply [Min]2.25 V, 1.71 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 2.82
10$ 2.54
25$ 2.40
100$ 2.08
250$ 1.97
500$ 1.88
Digi-Reel® 1$ 2.82
10$ 2.54
25$ 2.40
100$ 2.08
250$ 1.97
500$ 1.88
Tape & Reel (TR) 2000$ 1.05
Texas InstrumentsLARGE T&R 1$ 2.07
100$ 1.59
250$ 1.17
1000$ 0.84

Description

General part information

ISO6760-Q1 Series

The ISO6760L and ISO6760LN devices are high-performance, six-channel digital isolators with integrated interlock function for applications requiring up to 5000 VRMSisolation ratings per UL 1577. These devices are also certified by VDE, TUV, CSA, and CQC.

The ISO6760L family of devices integrate a series of logic gates to provide hardware interlock functionality for adjacent channels. The interlock feature ensures that each channel, in a channel pairing, will not be enabled at the same time. If both channels in the pairing share the same input logic, the output logic will always be low. The ISO6760L family of devices have all six channels in the same direction and provide high electromagnetic immunity and low emissions at low power consumption, while isolating CMOS or LVCMOS digital I/Os. Each isolation channel has a logic input and output buffer separated by TI’s double capacitive silicon dioxide (SiO2) insulation barrier.

Used in conjunction with intelligent power modules (IPMs), the interlock feature in these devices help prevent shoot through current between the high side and low side gate driver during turn on and turn off events. Six channels, including three pairings of interlock circuitry, are integrated in a 16-pin SOIC wide-body (DW) package with space savings greater than 50% compared to optocoupler solutions. Through innovative chip design and layout techniques, the electromagnetic compatibility of the ISO6760L devices has been significantly enhanced to ease system-level ESD, EFT, surge, and emissions compliance.