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Integrated Circuits (ICs)

BD6360GUL-E2

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Rohm Semiconductor

MOTOR / MOTION / IGNITION CONTROLLERS & DRIVERS DIGI STILL CAM 2CH STEP MOTOR DRVR

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Search across all available documentation for this part.

Documentsθ<sub>JA</sub> and Ψ<sub>JT</sub>Heat Dissipation Effect of Thermal Via in Exposed Pad Type Package +20

Product thumbnail image

Integrated Circuits (ICs)

BD6360GUL-E2

Active

Rohm Semiconductor

MOTOR / MOTION / IGNITION CONTROLLERS & DRIVERS DIGI STILL CAM 2CH STEP MOTOR DRVR

Deep-Dive with AI

Documentsθ<sub>JA</sub> and Ψ<sub>JT</sub>Heat Dissipation Effect of Thermal Via in Exposed Pad Type Package +20

Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	BD6360GUL-E2

Applications	General Purpose
Current - Output	400 mA
Function	Driver - Fully Integrated, Control and Power Stage
Interface	Logic
Motor Type - AC, DC	Brushed DC
Motor Type - Stepper	Bipolar
Mounting Type	Surface Mount
Operating Temperature [Max]	85 °C
Operating Temperature [Min]	-25 °C
Output Configuration	Half Bridge (2)
Package / Case	CSPBGA, 15-UFBGA
Supplier Device Package	15-VCSP50L2 (2.1x2.1)
Technology	CMOS
Voltage - Supply [Max]	5.5 V
Voltage - Supply [Min]	2.3 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	N/A	3000	$ 3.15
Mouser	N/A	1	$ 3.15
		10	$ 2.37
		25	$ 2.17
		100	$ 1.95
		250	$ 1.80
		500	$ 1.66
		1000	$ 1.55
		3000	$ 1.53

Description

General part information

BD6360GUL Series

The BD6360GUL was developed specifically for stepping motors in auto focus and zoom applications. The parallel interface requires just a control signal from the microcontroller in order to drive the motor.

Documents

Technical documentation and resources

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Heat Dissipation Effect of Thermal Via in Exposed Pad Type Package

Two-Resistor Model for Thermal Simulation

Judgment Criteria of Thermal Evaluation

What Is Thermal Design

Five Steps for Successful Thermal Design of IC

Compliance with the ELV directive

Environmental Data

θ<sub>JC</sub> and Ψ<sub>JT</sub>

PCB Layout Thermal Design Guide

BD6360GUL Data Sheet

Basics of Thermal Resistance and Heat Dissipation

BD6360GUL

Application Note

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Thermal Resistance

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Factory Information

Manufacturing Data

Solder Joint Rate and Thermal Resistance of Exposed Pad

Precautions When Measuring the Rear of the Package with a Thermocouple

Design Guide and Example of Stencil for Exposed Pad

BD6360GUL Package Information

Package Information

BD6360GUL Series

Part	Current - Output	Package / Case	Operating Temperature [Max]	Operating Temperature [Min]	Supplier Device Package	Applications	Mounting Type	Technology	Voltage - Supply [Max]	Voltage - Supply [Min]	Motor Type - Stepper	Interface	Function	Motor Type - AC, DC	Output Configuration
Rohm Semiconductor BD6360GUL-E2	400 mA	15-UFBGA CSPBGA	85 °C	-25 °C	15-VCSP50L2 (2.1x2.1)	General Purpose	Surface Mount	CMOS	5.5 V	2.3 V	Bipolar	Logic	Driver - Fully Integrated Control and Power Stage	Brushed DC	Half Bridge (2)