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8-SO
Integrated Circuits (ICs)

MC33662JEFR2

NRND
Freescale Semiconductor - NXP

LIN PHYSICAL LAYER, 7 V TO 18 V SUPPLY, 10 KBAUD, -40 °C TO 125 °C, NSOIC-8

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8-SO
Integrated Circuits (ICs)

MC33662JEFR2

NRND
Freescale Semiconductor - NXP

LIN PHYSICAL LAYER, 7 V TO 18 V SUPPLY, 10 KBAUD, -40 °C TO 125 °C, NSOIC-8

Deep-Dive with AI

DocumentsDatasheet

Technical Specifications

Parameters and characteristics for this part

SpecificationMC33662JEFR2
Data Rate10 kbps
DuplexHalf
Mounting TypeSurface Mount
Operating Temperature [Max]125 °C
Operating Temperature [Min]-40 °C
Package / Case8-SOIC
Package / Case [x]0.154 in
Package / Case [y]3.9 mm
ProtocolLINbus
Receiver Hysteresis175 mV
Supplier Device Package8-SOIC
TypeTransceiver
Voltage - Supply [Max]18 V
Voltage - Supply [Min]7 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTape & Reel (TR) 2500$ 0.91
5000$ 0.88
NewarkEach (Supplied on Full Reel) 1000$ 0.92
7500$ 0.86

Description

General part information

MC33662 Series

MC33662JEFR2 is an ISO 17987/LIN 2.x/SAEJ2602-2 LIN physical layer. The local interconnect network (LIN) is a serial communication protocol, designed to support automotive networks in conjunction with a CAN. As the lowest level of a hierarchical network, LIN enables cost-effective communication with sensors and actuators when all the features of CAN are not required. This integrates a fast baud rate (above 100Kbps), as reported by the RXD pin for test and programming modes. This provides excellent EMC and Radiated Emission performance, ESD robustness, and safe behavior, in the event of a LIN bus short-to-ground, or a LIN bus leakage during low-power mode. This device is powered by SMARTMOS technology. The application includes body electronics (BCM, gateway, roof, door, lighting, HVAC), powertrain (EMS, start and stop), BMS, safety, and Chassis (TPMS, seat belt).

Documents

Technical documentation and resources