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Discrete Semiconductor Products

RFN20NS6SFHTL

Active
Rohm Semiconductor

FAST RECOVERY DIODE (AEC-Q101 QUALIFIED)

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Search across all available documentation for this part.

DocumentsHow to Use LTspice® ModelsDiode Types and Applications+35
Product schematic image
Discrete Semiconductor Products

RFN20NS6SFHTL

Active
Rohm Semiconductor

FAST RECOVERY DIODE (AEC-Q101 QUALIFIED)

Deep-Dive with AI

DocumentsHow to Use LTspice® ModelsDiode Types and Applications+35

Technical Specifications

Parameters and characteristics for this part

SpecificationRFN20NS6SFHTL
Capacitance @ Vr, F322 pF
Current - Reverse Leakage @ Vr10 µA
GradeAutomotive
Mounting TypeSurface Mount
Operating Temperature - Junction [Max]150 °C
Package / CaseD2PAK (2 Leads + Tab), TO-263-3, TO-263AB
QualificationAEC-Q101
Reverse Recovery Time (trr)60 ns
Speed500 ns, 200 mA
Supplier Device PackageLPDS
TechnologyStandard
Voltage - DC Reverse (Vr) (Max) [Max]600 V
Voltage - Forward (Vf) (Max) @ If [Max]1.55 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 1105$ 1.82
NewarkEach (Supplied on Cut Tape) 1$ 1.78
10$ 1.27
25$ 1.15
50$ 1.04
100$ 0.93
300$ 0.84
500$ 0.74
1000$ 0.65

Description

General part information

RFN20NS6SFH Series

ROHM's fast recovery diodes are ultra high-speed, low VF, and suited for significant efficiency increase of switching power supply as well as reduction of switching loss.

Documents

Technical documentation and resources

How to Use LTspice® Models

Schematic Design & Verification

Diode Types and Applications

Technical Article

RFN20NS6SFH Data Sheet

Data Sheet

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Reliability Test Result

Manufacturing Data

What Is Thermal Design

Thermal Design

Part Explanation

Application Note

Anti-Whisker formation - Diodes

Package Information

Inner Structure

Package Information

PCB Layout Thermal Design Guide

Thermal Design

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

ESD Data

Characteristics Data

Report of SVHC under REACH Regulation

Environmental Data

Power Loss and Thermal Design of Diodes

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

List of Diode Package Thermal Resistance

Thermal Design

What is a Thermal Model? (Diode)

Thermal Design

Compliance of the RoHS directive

Environmental Data

Method for Monitoring Switching Waveform

Schematic Design & Verification

How to Select Rectifier Diodes

Technical Article

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

Two-Resistor Model for Thermal Simulation

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Constitution Materials List

Environmental Data

Notes for Calculating Power Consumption:Static Operation

Thermal Design

About Export Regulations

Export Information