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EMT6_EMT6 PKg
Discrete Semiconductor Products

EMB53T2R

Active
Rohm Semiconductor

PNP+PNP, SOT-563, DUAL DIGITAL TRANSISTOR (BIAS RESISTOR BUILT-IN TRANSISTOR)

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EMT6_EMT6 PKg
Discrete Semiconductor Products

EMB53T2R

Active
Rohm Semiconductor

PNP+PNP, SOT-563, DUAL DIGITAL TRANSISTOR (BIAS RESISTOR BUILT-IN TRANSISTOR)

Technical Specifications

Parameters and characteristics for this part

SpecificationEMB53T2R
Current - Collector (Ic) (Max) [Max]100 mA
Current - Collector Cutoff (Max) [Max]500 nA
DC Current Gain (hFE) (Min) @ Ic, Vce [Min]100
Frequency - Transition250 MHz
Mounting TypeSurface Mount
Package / CaseSOT-563, SOT-666
Resistor - Base (R1)4 kOhms
Supplier Device PackageEMT6
Transistor Type2 PNP Pre-Biased (Dual)
Vce Saturation (Max) @ Ib, Ic150 mV
Voltage - Collector Emitter Breakdown (Max) [Max]50 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.34
10$ 0.21
100$ 0.13
500$ 0.10
1000$ 0.09
2000$ 0.08
Digi-Reel® 1$ 0.34
10$ 0.21
100$ 0.13
500$ 0.10
1000$ 0.09
2000$ 0.08
Tape & Reel (TR) 8000$ 0.02
16000$ 0.02
24000$ 0.02
40000$ 0.02
NewarkEach (Supplied on Cut Tape) 1$ 0.35
10$ 0.21
25$ 0.19
50$ 0.16
100$ 0.13
250$ 0.12
500$ 0.10
1000$ 0.09

Description

General part information

EMB53 Series

Two DTA043T chips in a EMT6 package.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Constitution Materials List

Environmental Data

Taping Information

Package Information

PCB Layout Thermal Design Guide

Thermal Design

Compliance of the RoHS directive

Environmental Data

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

Reliability Test Result

Manufacturing Data

Moisture Sensitivity Level - Transistors

Package Information

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

About Export Regulations

Export Information

ESD Data

Characteristics Data

Anti-Whisker formation - Transistors

Package Information

How to Create Symbols for PSpice Models

Models

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Two-Resistor Model for Thermal Simulation

Thermal Design

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

What is a Thermal Model? (Transistor)

Thermal Design

Types and Features of Transistors

Application Note

What Is Thermal Design

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

How to Use LTspice® Models

Schematic Design & Verification

Inner Structure

Package Information

About Flammability of Materials

Environmental Data

List of Transistor Package Thermal Resistance

Thermal Design

Explanation for Marking

Package Information

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Part Explanation

Application Note

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Package Dimensions

Package Information