Zenode.ai Logo
Beta
Product Image
Connectors, Interconnects

ESQT-103-03-G-D-310

Active
Samtec Inc.

2MM 2MM DOUBLE ROW 4.5A GOLD -55℃~+125℃ 6P STRAIGHT 7.87MM PLUGIN,P=2MM FEMALE HEADERS ROHS

Deep-Dive with AI

Search across all available documentation for this part.

Product Image
Connectors, Interconnects

ESQT-103-03-G-D-310

Active
Samtec Inc.

2MM 2MM DOUBLE ROW 4.5A GOLD -55℃~+125℃ 6P STRAIGHT 7.87MM PLUGIN,P=2MM FEMALE HEADERS ROHS

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationESQT-103-03-G-D-310
Connector TypeElevated Socket
Contact Finish - MatingGold
Contact Finish - PostGold
Contact Finish Thickness - Mating0.51 µm
Contact Finish Thickness - Mating20 µin
Contact Finish Thickness - Post3 µin
Contact Finish Thickness - Post0.076 µm
Contact Length - Post3.76 mm
Contact Length - Post0.148 in
Contact MaterialPhosphor Bronze
Contact ShapeSquare
Contact TypeForked
Current Rating (Amps)4.5 A
Fastening TypePush-Pull
Insulation ColorBlack
Insulation Height0.31 in
Insulation Height7.87 mm
Insulation MaterialLiquid Crystal Polymer (LCP)
Material Flammability RatingUL94 V-0
Mounting TypeThrough Hole
Number of Positions6
Number of Positions LoadedAll
Number of Rows2
Operating Temperature [Max]125 °C
Operating Temperature [Min]-55 °C
Pitch - Mating [x]0.079 in
Pitch - Mating [x]2 mm
Row Spacing - Mating0.079 in
Row Spacing - Mating2 mm
StyleBoard to Board, Cable
TerminationSolder
...
PartMounting TypeInsulation HeightInsulation HeightMaterial Flammability RatingContact Finish - MatingCurrent Rating (Amps)Connector TypeInsulation MaterialOperating Temperature [Min]Operating Temperature [Max]TerminationContact Finish Thickness - MatingContact Finish Thickness - MatingPitch - Mating [x]Pitch - Mating [x]Number of RowsContact Finish - PostContact ShapeInsulation ColorFastening TypeNumber of Positions LoadedContact TypeStyleContact Length - PostContact Length - PostContact MaterialContact Finish Thickness - PostContact Finish Thickness - PostRow Spacing - MatingRow Spacing - MatingNumber of PositionsContact Length - Post [x]Contact Length - Post [x]Insulation Height [custom]Insulation Height [custom]
Through Hole
0.309 in
7.85 mm
UL94 V-0
Gold
4.5 A
Elevated Socket
Liquid Crystal Polymer (LCP)
-55 °C
125 °C
Solder
3 µin
0.076 µm
0.079 in
2 mm
1
Tin
Square
Black
Push-Pull
All
Forked
Board to Board
Cable
0.541 in
13.74 mm
Phosphor Bronze
Through Hole
0.31 in
7.87 mm
UL94 V-0
Gold
4.5 A
Elevated Socket
Liquid Crystal Polymer (LCP)
-55 °C
125 °C
Solder
20 µin
0.51 µm
0.079 in
2 mm
2
Gold
Square
Black
Push-Pull
All
Forked
Board to Board
Cable
0.148 in
3.76 mm
Phosphor Bronze
3 µin
0.076 µm
0.079 in
2 mm
6
Through Hole
0.51 in
12.95 mm
UL94 V-0
Gold
4.5 A
Elevated Socket
Liquid Crystal Polymer (LCP)
-55 °C
125 °C
Solder
3 µin
0.076 µm
0.079 in
2 mm
2
Tin
Square
Black
Push-Pull
All
Forked
Board to Board
Cable
Phosphor Bronze
0.079 in
2 mm
6
8.64 mm
0.34 in
Through Hole
UL94 V-0
Gold
4.5 A
Elevated Socket
Liquid Crystal Polymer (LCP)
-55 °C
125 °C
Solder
30 Áin
0.76 Ám
0.079 in
2 mm
2
Gold
Square
Black
Push-Pull
All
Forked
Board to Board
Cable
0.43 in
10.92 mm
Phosphor Bronze
3 µin
0.076 µm
0.079 in
2 mm
6
0.42 in
10.67 mm
Through Hole
0.461 "
11.7 mm
UL94 V-0
Gold
4.5 A
Elevated Socket
Liquid Crystal Polymer (LCP)
-55 °C
125 °C
Solder
20 µin
0.51 µm
0.079 in
2 mm
2
Gold
Square
Black
Push-Pull
All
Forked
Board to Board
Cable
Phosphor Bronze
3 µin
0.076 µm
0.079 in
2 mm
6
9.88 mm
0.389 in
Through Hole
0.8 in
20.32 mm
UL94 V-0
Gold
4.5 A
Elevated Socket
Liquid Crystal Polymer (LCP)
-55 °C
125 °C
Solder
3 µin
0.076 µm
0.079 in
2 mm
2
Tin
Square
Black
Push-Pull
All
Forked
Board to Board
Cable
0.05 in
1.27 mm
Phosphor Bronze
0.079 in
2 mm
6
Through Hole
0.37 in
9.4 mm
UL94 V-0
Gold
4.5 A
Elevated Socket
Liquid Crystal Polymer (LCP)
-55 °C
125 °C
Solder
10 çin
0.25 çm
0.079 in
2 mm
2
Tin
Square
Black
Push-Pull
All
Forked
Board to Board
Cable
Phosphor Bronze
0.079 in
2 mm
6
2.23 mm
0.088 in
Through Hole
UL94 V-0
Gold
4.5 A
Elevated Socket
Liquid Crystal Polymer (LCP)
-55 °C
125 °C
Solder
20 µin
0.51 µm
0.079 in
2 mm
2
Gold
Square
Black
Push-Pull
All
Forked
Board to Board
Cable
0.108 in
2.75 mm
Phosphor Bronze
3 µin
0.076 µm
0.079 in
2 mm
6
0.35 in
8.89 mm
Through Hole
UL94 V-0
Gold
4.5 A
Elevated Socket
Liquid Crystal Polymer (LCP)
-55 °C
125 °C
Solder
10 çin
0.25 çm
0.079 in
2 mm
2
Tin
Square
Black
Push-Pull
All
Forked
Board to Board
Cable
0.44 in
11.18 mm
Phosphor Bronze
0.079 in
2 mm
6
Through Hole
0.408 in
10.36 mm
UL94 V-0
Gold
4.5 A
Elevated Socket
Liquid Crystal Polymer (LCP)
-55 °C
125 °C
Solder
20 µin
0.51 µm
0.079 in
2 mm
1
Gold
Square
Black
Push-Pull
All
Forked
Board to Board
Cable
0.442 in
11.23 mm
Phosphor Bronze
3 µin
0.076 µm

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 1$ 6.98
LCSCPiece 1$ 10.55
200$ 4.21
500$ 4.07
1000$ 4.00

Description

General part information

ESQT-103 Series

6 Position Elevated Socket Connector 0.079" (2.00mm) Through Hole Gold

Documents

Technical documentation and resources

No documents available