Specification	NVTFS052P04M8LTAG

Current - Continuous Drain (Id) @ 25°C	13.2 A, 4.7 A
Drain to Source Voltage (Vdss)	40 V
Drive Voltage (Max Rds On, Min Rds On)	10 V, 4.5 V
FET Type	P-Channel
Gate Charge (Qg) (Max) @ Vgs	6.3 nC
Grade	Automotive
Input Capacitance (Ciss) (Max) @ Vds	424 pF
Mounting Type	Surface Mount
Operating Temperature [Max]	175 ░C
Operating Temperature [Min]	-55 °C
Package / Case	8-PowerWDFN
Power Dissipation (Max)	2.9 W, 23 W
Qualification	AEC-Q101
Rds On (Max) @ Id, Vgs	69 mOhm
Supplier Device Package	8-WDFN (3.3x3.3)
Technology	MOSFET (Metal Oxide)
Vgs (Max)	20 V
Vgs(th) (Max) @ Id	2.4 V

NVTFS052P04M8L Series

Power MOSFET, Single P-Channel, -40V, 69mΩ, -13.2A

Part	Mounting Type	Vgs (Max)	Grade	Input Capacitance (Ciss) (Max) @ Vds	FET Type	Package / Case	Current - Continuous Drain (Id) @ 25°C	Operating Temperature [Min]	Operating Temperature [Max]	Qualification	Gate Charge (Qg) (Max) @ Vgs	Supplier Device Package	Rds On (Max) @ Id, Vgs	Technology	Power Dissipation (Max)	Drain to Source Voltage (Vdss)	Drive Voltage (Max Rds On, Min Rds On)	Vgs(th) (Max) @ Id
ON Semiconductor NVTFS052P04M8LTAG	Surface Mount	20 V	Automotive	424 pF	P-Channel	8-PowerWDFN	4.7 A 13.2 A	-55 °C	175 ░C	AEC-Q101	6.3 nC	8-WDFN (3.3x3.3)	69 mOhm	MOSFET (Metal Oxide)	2.9 W 23 W	40 V	4.5 V 10 V	2.4 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Cut Tape (CT)	1	$ 1.19
		10	$ 0.81
		100	$ 0.54
		500	$ 0.42
	Digi-Reel®	1	$ 1.19
		10	$ 0.81
		100	$ 0.54
		500	$ 0.42
	Tape & Reel (TR)	1500	$ 0.33
		3000	$ 0.31
		4500	$ 0.30
		7500	$ 0.29
		10500	$ 0.29
Newark	Each	1000	$ 0.38
		2500	$ 0.31
		10000	$ 0.30
ON Semiconductor	N/A	1	$ 0.26

Description

General part information

NVTFS052P04M8L Series

Automotive Power MOSFET in a 3.3x3.3 wDFN8 package designed for compact and efficient designs and including high thermal performance. AEC-Q101 Qualified MOSFET and PPAP capable suitable for automotive applications requiring enhanced board level reliability.