Connectors, Interconnects

163A17849X

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Amphenol CONEC

CONN D-SUB HD PLUG 15P R/A SLDR

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Connectors, Interconnects

163A17849X

Active

Amphenol CONEC

CONN D-SUB HD PLUG 15P R/A SLDR

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Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	163A17849X

Backset Spacing	0.314 in
Backset Spacing	7.98 mm
Color	Black
Connector Style	High Density, D-Sub
Connector Type	Plug, Male Pins
Contact Finish	Gold
Contact Finish Thickness	8 çin
Contact Finish Thickness	0.203 çm
Contact Material	Copper Alloy
Contact Type	Signal
Current Rating (Amps)	3 A
Dielectric Material	Polybutylene Terephthalate (PBT), Glass Filled
Features	Grounding Indents, Board Lock
Flange Feature	4-40
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole, Right Angle, Board Edge
Number of Positions	15
Number of Rows	3
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-55 °C
Shell Size, Connector Layout [custom]	DE, E
Shell Size, Connector Layout [custom]	1
Shell Size, Connector Layout [custom]	High Density
Termination	Solder
Voltage Rating	60 VDC

163A178 Series

Part	Contact Material	Contact Finish	Shell Size, Connector Layout [custom]	Shell Size, Connector Layout [custom]	Shell Size, Connector Layout [custom]	Features	Number of Positions	Connector Type	Mounting Type	Material Flammability Rating	Color	Contact Type	Backset Spacing	Backset Spacing	Contact Finish Thickness	Contact Finish Thickness	Voltage Rating	Flange Feature	Current Rating (Amps)	Dielectric Material	Connector Style	Number of Rows	Operating Temperature [Min]	Operating Temperature [Max]	Termination	Shell Size, Connector Layout [x]	Shell Size, Connector Layout	Shell Size, Connector Layout
Amphenol CONEC 163A17809X	Copper Alloy	Gold	DE E	1	High Density	Board Lock Grounding Indents	15	Male Pins Plug	Board Edge Right Angle Through Hole	UL94 V-0	Black	Signal	0.314 in	7.98 mm	0.51 µm	20 µin	60 VDC	Housing/Shell (M3)	3 A	Polybutylene Terephthalate (PBT) Glass Filled	D-Sub High Density	3	-55 °C	125 °C	Solder
Amphenol CONEC 163A17829X	Copper Alloy	Gold	B DB			Board Lock Grounding Indents	44	Male Pins Plug	Board Edge Right Angle Through Hole	UL94 V-0	Black	Signal	0.314 in	7.98 mm	0.51 µm	20 µin	60 VDC	Housing/Shell (M3)	3 A	Polybutylene Terephthalate (PBT) Glass Filled	D-Sub High Density	3	-55 °C	125 °C	Solder	3
Amphenol CONEC 163A17849X	Copper Alloy	Gold	DE E	1	High Density	Board Lock Grounding Indents	15	Male Pins Plug	Board Edge Right Angle Through Hole	UL94 V-0	Black	Signal	0.314 in	7.98 mm	0.203 çm	8 çin	60 VDC	4-40	3 A	Polybutylene Terephthalate (PBT) Glass Filled	D-Sub High Density	3	-55 °C	125 °C	Solder
Amphenol CONEC 163A17819X	Copper Alloy	Gold				Board Lock Grounding Indents	26	Male Pins Plug	Board Edge Right Angle Through Hole	UL94 V-0	Black	Signal	0.314 in	7.98 mm	0.51 µm	20 µin	60 VDC	Housing/Shell (M3)	3 A	Polybutylene Terephthalate (PBT) Glass Filled	D-Sub High Density	3	-55 °C	125 °C	Solder		2	(DA A) High Density

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	30	$ 13.10

Description

General part information

163A178 Series

15 Position D-Sub, High Density Plug, Male Pins Connector

Documents

Technical documentation and resources