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TAIWAN SEMICONDUCTOR TSM2323CX RFG
Discrete Semiconductor Products

RQ5C060BCTCL

Active
Rohm Semiconductor

PCH -20V -6A MIDDLE POWER MOSFET

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TAIWAN SEMICONDUCTOR TSM2323CX RFG
Discrete Semiconductor Products

RQ5C060BCTCL

Active
Rohm Semiconductor

PCH -20V -6A MIDDLE POWER MOSFET

Technical Specifications

Parameters and characteristics for this part

SpecificationRQ5C060BCTCL
Current - Continuous Drain (Id) @ 25°C6 A
Drain to Source Voltage (Vdss)20 V
Drive Voltage (Max Rds On, Min Rds On)4.5 V
FET TypeP-Channel
Input Capacitance (Ciss) (Max) @ Vds [Max]1360 pF
Mounting TypeSurface Mount
Operating Temperature [Max]150 °C
Operating Temperature [Min]-55 °C
Package / CaseSC-96
Power Dissipation (Max) [Max]1 W
Rds On (Max) @ Id, Vgs [Max]21.1 mOhm
Supplier Device PackageTSMT3
TechnologyMOSFET (Metal Oxide)
Vgs (Max) [Max]8 V
Vgs(th) (Max) @ Id1.2 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 5479$ 1.08
NewarkEach (Supplied on Cut Tape) 1$ 0.78
10$ 0.60
25$ 0.55
50$ 0.49
100$ 0.44
250$ 0.40
500$ 0.35
1000$ 0.32

Description

General part information

RQ5C060BC Series

RQ5C060BC is Low on-resistance and high power small mold package MOSFET for switching.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

About Flammability of Materials

Environmental Data

Moisture Sensitivity Level - Transistors

Package Information

Explanation for Marking

Package Information

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Reliability Test Result

Manufacturing Data

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Method for Monitoring Switching Waveform

Schematic Design & Verification

Compliance of the RoHS directive

Environmental Data

Part Explanation

Application Note

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Taping Information

Package Information

List of Transistor Package Thermal Resistance

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

P-channel Power MOSFETs selection guide

Technical Article

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Certificate of not containing SVHC under REACH Regulation

Environmental Data

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Types and Features of Transistors

Application Note

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Anti-Whisker formation - Transistors

Package Information

ESD Data

Characteristics Data

Inner Structure

Package Information

Two-Resistor Model for Thermal Simulation

Thermal Design

What is a Thermal Model? (Transistor)

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Package Dimensions

Package Information

PCB Layout Thermal Design Guide

Thermal Design

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Notes for Temperature Measurement Using Thermocouples

Thermal Design

What Is Thermal Design

Thermal Design

How to Use LTspice® Models

Schematic Design & Verification

About Export Regulations

Export Information

How to Create Symbols for PSpice Models

Models