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Isolators

BM6102FV-CE2

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Rohm Semiconductor

1CH GATE DRIVER PROVIDING GALVANIC ISOLATION

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Product dimension image
Isolators

BM6102FV-CE2

Active
Rohm Semiconductor

1CH GATE DRIVER PROVIDING GALVANIC ISOLATION

Technical Specifications

Parameters and characteristics for this part

SpecificationBM6102FV-CE2
Common Mode Transient Immunity (Min) [Min]100 V/ns
Current - Peak Output5 A, 1 A
GradeAutomotive
Mounting TypeSurface Mount
Number of Channels [custom]1
Operating Temperature [Max]125 °C
Operating Temperature [Min]-40 C
Package / Case0.24 "
Package / Case20-SSOP
Package / Case [y]6.1 mm
Propagation Delay tpLH / tpHL (Max) [Max] [custom]200 ns
Propagation Delay tpLH / tpHL (Max) [Max] [custom]200 ns
QualificationAEC-Q100
Rise / Fall Time (Typ) [custom]50 ns
Rise / Fall Time (Typ) [custom]50 ns
Supplier Device Package20-SSOP-BW
TechnologyMagnetic Coupling
Voltage - Isolation2500 Vrms
Voltage - Output Supply [Max]20 V
Voltage - Output Supply [Min]14 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 0$ 0.00

Description

General part information

BM6102FV-C Series

The BM6102FV-C is a gate driver with isolation voltage 2500Vrms, I/O delay time of 200ns, and minimum input pulse width of 100ns, and incorporates the fault signal output functions, undervoltage lockout (UVLO) function, thermal protection function, and short current protection (SCP, DESAT) function.For sale of this product, please contact the specifications in our sales office. Currently, we don't sell this on the internet distributors now.

Documents

Technical documentation and resources

How to Use the Two-Resistor Model

Thermal Design

What Is Thermal Design

Thermal Design

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Thermal Resistance

Thermal Design

Factory Information

Manufacturing Data

Compliance with the ELV directive

Environmental Data

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

The Problem with Traditional Vaccine Storage Freezers and How ROHM Cutting-edge Power Solutions Can Take them to the Next Level

White Paper

Cutting-Edge Web Simulation Tool "ROHM Solution Simulator" Capable of Complete Circuit Verification of Power Devices and Driver ICs

White Paper

UL94 Flame Classifications of Mold Compound

Environmental Data

BM6102FV-C Data Sheet

Data Sheet

Solder Joint Rate and Thermal Resistance of Exposed Pad

Thermal Design

Heat Dissipation Effect of Thermal Via in Exposed Pad Type Package

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

SSOP-B20W Package Information

Package Information

Judgment Criteria of Thermal Evaluation

Thermal Design

Anti-Whisker formation

Package Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Design Guide and Example of Stencil for Exposed Pad

Thermal Design

Five Steps for Successful Thermal Design of IC

White Paper

AEC-Q101 Automotive Requirements

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