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488~948F~DT~16
Integrated Circuits (ICs)

NCV75215DB001R2G

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ON Semiconductor

ULTRASONIC PARKING DISTANCE MEASUREMENT ASSP

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488~948F~DT~16
Integrated Circuits (ICs)

NCV75215DB001R2G

Active
ON Semiconductor

ULTRASONIC PARKING DISTANCE MEASUREMENT ASSP

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationNCV75215DB001R2G
Current - Supply [Max]8 mA
GradeAutomotive
Mounting TypeSurface Mount
Operating Temperature [Max]85 °C
Operating Temperature [Min]-40 °C
Package / Case16-TSSOP
Package / Case [x]0.173 in
Package / Case [y]4.4 mm
Supplier Device Package16-TSSOP
Voltage - Supply [Max]18 V
Voltage - Supply [Min]6 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 2.51
10$ 2.26
25$ 2.13
100$ 1.70
250$ 1.49
500$ 1.45
1000$ 1.15
Digi-Reel® 1$ 2.51
10$ 2.26
25$ 2.13
100$ 1.70
250$ 1.49
500$ 1.45
1000$ 1.15
Tape & Reel (TR) 4000$ 1.11
8000$ 1.06
NewarkEach 2500$ 1.13
5000$ 1.10
ON SemiconductorN/A 1$ 1.12

Description

General part information

NCV75215DB001R2G Series

The NCV75215 ASSP is intended to operate with a piezoelectric ultrasonic transducer to provide time-of-flight measurement of an obstacle distance during vehicle parking. The high-sensitivity, low-noise operation allows detection from 0.25 m up to 4.5 m for a standard 75 mm pole. The device drives the ultrasonic transducer with a programmable frequency via a transformer. The received echo is amplified and converted to a digital signal, filtered, detected and the magnitude is compared to a time-dependent threshold which is stored in an internal RAM. A bidirectional I/O Line is used to communicate with a master (ECU). The master issues I/O Line commands to the NCV75215 and data are reported back via the same line.

Documents

Technical documentation and resources