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ROHM RB088LAM150TFTR
Discrete Semiconductor Products

RF081MM2STR

Active
Rohm Semiconductor

RECTIFIER, SINGLE, 1A, 200V, SOD-123

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ROHM RB088LAM150TFTR
Discrete Semiconductor Products

RF081MM2STR

Active
Rohm Semiconductor

RECTIFIER, SINGLE, 1A, 200V, SOD-123

Technical Specifications

Parameters and characteristics for this part

SpecificationRF081MM2STR
Current - Average Rectified (Io)800 mA
Current - Reverse Leakage @ Vr10 ÁA
Mounting TypeSurface Mount
Operating Temperature - Junction [Max]150 °C
Package / CaseSOD-123F
Reverse Recovery Time (trr)25 ns
Speed500 ns, 200 mA
Supplier Device PackagePMDU
TechnologyStandard
Voltage - DC Reverse (Vr) (Max) [Max]200 V
Voltage - Forward (Vf) (Max) @ If950 mV

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 53312$ 0.48
NewarkEach (Supplied on Cut Tape) 1$ 0.40
10$ 0.26
25$ 0.22
50$ 0.18
100$ 0.14
250$ 0.13
500$ 0.13
1000$ 0.12

Description

General part information

RF081MM2S Series

RF081MM2S is silicon epitaxial planar type Standard Fast Recovery Diode.

Documents

Technical documentation and resources

Product Change Notice EN

Datasheet

Technical Data Sheet EN

Datasheet

About Flammability of Materials

Environmental Data

Diode Types and Applications

Technical Article

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Anti-Whisker formation - Diodes

Package Information

Part Explanation

Application Note

Two-Resistor Model for Thermal Simulation

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

ESD Data

Characteristics Data

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

Report of SVHC under REACH Regulation

Environmental Data

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

Package Dimensions

Package Information

How to Use LTspice&reg; Models

Schematic Design & Verification

Reliability Test Result

Manufacturing Data

Power Loss and Thermal Design of Diodes

Thermal Design

Taping Information

Package Information

PCB Layout Thermal Design Guide

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Advantages of PMDE Compact Package with High Heat Dissipation for Automotive Schottky Barrier Diodes

Technical Article

About Export Regulations

Export Information

Inner Structure

Package Information

Moisture Sensitivity Level - Diodes

Package Information

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Method for Monitoring Switching Waveform

Schematic Design & Verification

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

What is a Thermal Model? (Diode)

Thermal Design

How to Select Rectifier Diodes

Technical Article

How to Create Symbols for PSpice Models

Models

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

List of Diode Package Thermal Resistance

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

RF081MM2S Data Sheet

Data Sheet

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Explanation for Marking

Package Information

What Is Thermal Design

Thermal Design

Compliance of the RoHS directive

Environmental Data