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RD3H200SNTL1
Discrete Semiconductor Products

RD3H200SNTL1

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Rohm Semiconductor

MOSFET, N-CH, 45V, 20A, 150DEG C, 20W

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RD3H200SNTL1
Discrete Semiconductor Products

RD3H200SNTL1

Active
Rohm Semiconductor

MOSFET, N-CH, 45V, 20A, 150DEG C, 20W

Technical Specifications

Parameters and characteristics for this part

SpecificationRD3H200SNTL1
Current - Continuous Drain (Id) @ 25°C20 A
Drain to Source Voltage (Vdss)45 V
Drive Voltage (Max Rds On, Min Rds On) [Max]4 V
Drive Voltage (Max Rds On, Min Rds On) [Min]10 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs [Max]12 nC
Input Capacitance (Ciss) (Max) @ Vds950 pF
Mounting TypeSurface Mount
Operating Temperature [Max]150 °C
Operating Temperature [Min]-55 °C
Package / CaseTO-252-3, SC-63, DPAK (2 Leads + Tab)
Power Dissipation (Max)20 W
Rds On (Max) @ Id, Vgs28 mOhm
Supplier Device PackageTO-252
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max) @ Id2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 2907$ 1.57
NewarkEach (Supplied on Cut Tape) 1$ 1.55
10$ 1.20
25$ 1.08
50$ 0.97
100$ 0.86
250$ 0.77
500$ 0.69
1000$ 0.64

Description

General part information

RD3H200SN Series

RD3H200SN is a Power MOSFET with Low on - resistance, suitable for Switching.

Documents

Technical documentation and resources

Report of SVHC under REACH Regulation

Environmental Data

RD3H200SN ESD Data

Characteristics Data

Types and Features of Transistors

Application Note

Notes for Temperature Measurement Using Thermocouples

Thermal Design

RD3H200SN Data Sheet

Data Sheet

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

About Flammability of Materials

Environmental Data

Two-Resistor Model for Thermal Simulation

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

TO-252_TL1 Taping Information

Package Information

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Package Dimensions

Package Information

Reliability Test Result

Manufacturing Data

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Moisture Sensitivity Level - Transistors

Package Information

About Export Regulations

Export Information

How to Use LTspice® Models

Schematic Design & Verification

What Is Thermal Design

Thermal Design

Anti-Whisker formation - Transistors

Package Information

Condition of Soldering / Land Pattern Reference

Package Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

What is a Thermal Model? (Transistor)

Thermal Design

List of Transistor Package Thermal Resistance

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

How to Create Symbols for PSpice Models

Models

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Compliance of the RoHS directive

Environmental Data

Part Explanation

Application Note

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification