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LITTELFUSE LJ6008D8TP
Discrete Semiconductor Products

2SAR574D3FRATL

Active
Rohm Semiconductor

PNP, TO-252 (DPAK), -80V -2A, POWER TRANSISTOR FOR AUTOMOTIVE

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Search across all available documentation for this part.

DocumentsTechnical Data Sheet ENHow to Create Symbols for PSpice Models+37
LITTELFUSE LJ6008D8TP
Discrete Semiconductor Products

2SAR574D3FRATL

Active
Rohm Semiconductor

PNP, TO-252 (DPAK), -80V -2A, POWER TRANSISTOR FOR AUTOMOTIVE

Deep-Dive with AI

DocumentsTechnical Data Sheet ENHow to Create Symbols for PSpice Models+37

Technical Specifications

Parameters and characteristics for this part

Specification2SAR574D3FRATL
Current - Collector (Ic) (Max) [Max]2 A
Current - Collector Cutoff (Max) [Max]1 µA
DC Current Gain (hFE) (Min) @ Ic, Vce [Min]180
GradeAutomotive
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseTO-252-3, SC-63, DPAK (2 Leads + Tab)
Power - Max [Max]10 W
QualificationAEC-Q101
Supplier Device PackageTO-252
Vce Saturation (Max) @ Ib, Ic400 mV
Voltage - Collector Emitter Breakdown (Max) [Max]80 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 2.27
10$ 1.46
100$ 0.99
500$ 0.79
1000$ 0.73
Digi-Reel® 1$ 2.27
10$ 1.46
100$ 0.99
500$ 0.79
1000$ 0.73
N/A 0$ 2.26
Tape & Reel (TR) 2500$ 0.62
NewarkEach (Supplied on Cut Tape) 1$ 2.28
10$ 1.47
25$ 1.25
50$ 1.12
100$ 1.00
250$ 0.92
500$ 0.80
1000$ 0.73

Description

General part information

2SAR574 Series

2SAR574D3FRA is a power transistor with Low VCE(sat), suitable for low frequency amplifier.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

How to Create Symbols for PSpice Models

Models

Report of SVHC under REACH Regulation

Environmental Data

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Part Explanation

Application Note

Explanation for Marking

Package Information

Moisture Sensitivity Level - Transistors

Package Information

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

TO-252_TL Taping Information

Package Information

What Is Thermal Design

Thermal Design

About Export Regulations

Export Information

2SAR574D3 Thermal Resistance

Characteristics Data

2SAR574D3FRA ESD Data

Characteristics Data

Types and Features of Transistors

Application Note

About Flammability of Materials

Environmental Data

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Package Dimensions

Package Information

List of Transistor Package Thermal Resistance

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Inner Structure

Package Information

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Compliance of the RoHS directive

Environmental Data

What is a Thermal Model? (Transistor)

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

Anti-Whisker formation - Transistors

Package Information

How to Use LTspice® Models

Schematic Design & Verification

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Report of SVHC under REACH Regulation

Environmental Data

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification