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RF6E065BNTCR
Discrete Semiconductor Products

US6K1TR

Active
Rohm Semiconductor

SMALL SIGNAL FIELD-EFFECT TRANSISTOR, 1.5A I(D), 30V, 2-ELEMENT, N-CHANNEL, SILICON, METAL-OXIDE SEMICONDUCTOR FET, TUMT6, 6 PIN

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RF6E065BNTCR
Discrete Semiconductor Products

US6K1TR

Active
Rohm Semiconductor

SMALL SIGNAL FIELD-EFFECT TRANSISTOR, 1.5A I(D), 30V, 2-ELEMENT, N-CHANNEL, SILICON, METAL-OXIDE SEMICONDUCTOR FET, TUMT6, 6 PIN

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Technical Specifications

Parameters and characteristics for this part

SpecificationUS6K1TR
Configuration2 N-Channel (Dual)
Current - Continuous Drain (Id) @ 25°C1.5 A
Drain to Source Voltage (Vdss)30 V
FET FeatureLogic Level Gate
Gate Charge (Qg) (Max) @ Vgs2.2 nC
Input Capacitance (Ciss) (Max) @ Vds80 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / Case6-SMD, Flat Leads
Power - Max [Max]1 W
Rds On (Max) @ Id, Vgs240 mOhm
Supplier Device PackageTUMT6
TechnologyMOSFET (Metal Oxide)
Vgs(th) (Max) @ Id1.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.58
10$ 0.50
100$ 0.35
500$ 0.29
1000$ 0.25
Digi-Reel® 1$ 0.58
10$ 0.50
100$ 0.35
500$ 0.29
1000$ 0.25
Tape & Reel (TR) 3000$ 0.17
NewarkEach 1$ 0.87
10$ 0.52
100$ 0.35
500$ 0.28
1000$ 0.26
2500$ 0.23
10000$ 0.19

Description

General part information

US6K1 Series

Complex type MOSFETs(N+N) are made as low ON-resistance devices by the micro-processing technologies useful for wide range of applications. Broad lineup covering compact types, high-power types and complex types to meet various needs in the market.

Documents

Technical documentation and resources

TUMT6 Part Marking

Related Document

TUMT6 TR Taping Spec

Datasheet

Transistor, MOSFET Flammability

Related Document

What Is Thermal Design

Thermal Design

About Export Regulations

Export Information

Moisture Sensitivity Level - Transistors

Package Information

Part Explanation

Application Note

PCB Layout Thermal Design Guide

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Explanation for Marking

Package Information

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Taping Information

Package Information

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

About Flammability of Materials

Environmental Data

Package Dimensions

Package Information

List of Transistor Package Thermal Resistance

Thermal Design

How to Create Symbols for PSpice Models

Models

Two-Resistor Model for Thermal Simulation

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Method for Monitoring Switching Waveform

Schematic Design & Verification

Inner Structure

Package Information

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Types and Features of Transistors

Application Note

What is a Thermal Model? (Transistor)

Thermal Design

ESD Data

Characteristics Data

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification