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B3QFN (RDA)
Power Supplies - Board Mount

TPSM560R6RDAR

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Texas Instruments

4.2-V TO 60-V INPUT, 1-V TO 6-V OUTPUT, 0.6-A STEP-DOWN MODULE IN 5-MM X 5.5-MM X 4-MM QFN

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B3QFN (RDA)
Power Supplies - Board Mount

TPSM560R6RDAR

Active
Texas Instruments

4.2-V TO 60-V INPUT, 1-V TO 6-V OUTPUT, 0.6-A STEP-DOWN MODULE IN 5-MM X 5.5-MM X 4-MM QFN

Technical Specifications

Parameters and characteristics for this part

SpecificationTPSM560R6RDAR
ApplicationsITE (Commercial)
Current - Output (Max) [Max]600 mA
Efficiency86 %
FeaturesStandby Output, Adjustable Output
Mounting TypeSurface Mount
Number of Outputs1
Operating Temperature [Max]125 °C
Operating Temperature [Min]-40 C
Package / Case15-PowerBQFN Module
Power (Watts)3.6 W
Size / Dimension [x]5 mm
Size / Dimension [x]0.2 in
Size / Dimension [y]5.5 mm
Size / Dimension [y]0.22 in
Size / Dimension [z]0.16 in
Size / Dimension [z]4.1 mm
Supplier Device Package15-B3QFN (5x5.5)
TypeNon-Isolated PoL Module
Voltage - Input (Max) [Max]60 V
Voltage - Input (Min) [Min]4.2 V
Voltage - Output 1 [Max]6 V
Voltage - Output 1 [Min]1 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 1$ 8.11
Texas InstrumentsLARGE T&R 1$ 5.15
100$ 4.20
250$ 3.30
1000$ 2.80

Description

General part information

TPSM560R6 Series

The TPSM560R6 power module is a highly integrated 600-mA power solution that combines a 60-V input, step-down DC/DC converter with power MOSFETs, a shielded inductor, and passives in a thermally-enhanced QFN package. The 5.0-mm × 5.5-mm × 4.0-mm, 15-pin QFN package uses Enhanced HotRod QFN technology for enhanced thermal performance, small footprint, and low EMI. The package footprint has all pins accessible from the perimeter and a single large thermal pad for simple layout and easy handling in manufacturing.

The TPSM560R6 is a compact, easy-to-use power module with a wide adjustable output voltage range of 1.0 V to 6 V. The total solution requires as few as four external components and eliminates the loop compensation and magnetics part selection from the design process. The full feature set includes power good, programmable UVLO, prebias start-up, overcurrent, and temperature protections, making the TPSM560R6 an excellent device for powering a wide range of applications. Space-constrained applications benefit from the 5.0-mm × 5.5-mm package.

The TPSM560R6 power module is a highly integrated 600-mA power solution that combines a 60-V input, step-down DC/DC converter with power MOSFETs, a shielded inductor, and passives in a thermally-enhanced QFN package. The 5.0-mm × 5.5-mm × 4.0-mm, 15-pin QFN package uses Enhanced HotRod QFN technology for enhanced thermal performance, small footprint, and low EMI. The package footprint has all pins accessible from the perimeter and a single large thermal pad for simple layout and easy handling in manufacturing.