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HSOIC (DDA)
Integrated Circuits (ICs)

TPS54360QDDAQ1

NRND
Texas Instruments

4.5-V TO 60-V INPUT, 3.5-A, STEP-DOWN DC-DC CONVERTER WITH ECO-MODE™

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HSOIC (DDA)
Integrated Circuits (ICs)

TPS54360QDDAQ1

NRND
Texas Instruments

4.5-V TO 60-V INPUT, 3.5-A, STEP-DOWN DC-DC CONVERTER WITH ECO-MODE™

Technical Specifications

Parameters and characteristics for this part

SpecificationTPS54360QDDAQ1
Current - Output3.5 A
Frequency - Switching [Max]2.5 MHz
Frequency - Switching [Min]100 kHz
FunctionStep-Down
GradeAutomotive
Mounting TypeSurface Mount
Number of Outputs1
Operating Temperature [Max]150 °C
Operating Temperature [Min]-40 °C
Output ConfigurationPositive
Output TypeAdjustable
Package / Case8-PowerSOIC
Package / Case [x]0.154 in
Package / Case [y]3.9 mm
QualificationAEC-Q100
Supplier Device Package8-SO PowerPad
Synchronous RectifierFalse
TopologySplit Rail, Buck
Voltage - Input (Max) [Max]60 V
Voltage - Input (Min) [Min]4.5 V
Voltage - Output (Max) [Max]58.8 V
Voltage - Output (Min/Fixed)0.8 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTube 1$ 7.22
10$ 4.96
25$ 4.38
100$ 3.73
250$ 3.46
Texas InstrumentsTUBE 1$ 6.30
100$ 5.52
250$ 3.87
1000$ 3.12

Description

General part information

TPS54360B-Q1 Series

The TPS54360B-Q1 is a 60-V 3.5-A step-down regulator with an integrated high-side MOSFET. The device survives load dump pulses up to 65 V per ISO 7637. Current mode control provides simple external compensation and flexible component selection. A low-ripple pulse-skip mode reduces the no-load supply current to 146 µA. Shutdown supply current is reduced to 2 µA when the enable pin is pulled low.

Undervoltage lockout is internally set at 4.3 V but can be increased using an external resistor divider at the enable pin. The output voltage start-up ramp is internally controlled to provide a controlled start up and eliminate overshoot.

A wide adjustable frequency range allows either efficiency or external component size to be optimized. Frequency foldback and thermal shutdown protects internal and external components during an overload condition.