Connectors, Interconnects

XG4C-5014

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Omron Electronics Inc-EMC Div

CONN HEADER 50POS 2.54MM

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Connectors, Interconnects

XG4C-5014

Active

Omron Electronics Inc-EMC Div

CONN HEADER 50POS 2.54MM

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Technical Specifications

Parameters and characteristics for this part

Specification	XG4C-5014

Connector Type	Header
Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating [custom]	5.9 µin
Contact Finish Thickness - Mating [custom]	0.15 µm
Contact Finish Thickness - Post [custom]	78.7 µin
Contact Finish Thickness - Post [custom]	2 µm
Contact Material	Brass
Contact Shape	Square
Contact Type	Male Pin
Current Rating (Amps)	3 A
Fastening Type	Push-Pull
Insulation Color	Black
Insulation Material	Polybutylene Terephthalate (PBT), Glass Filled
Material Flammability Rating	UL94 V-0
Number of Positions	50
Operating Temperature [Max]	105 ░C
Operating Temperature [Min]	-55 C
Pitch - Mating	0.1 "
Pitch - Mating	2.54 mm
Row Spacing - Mating [x]	0.1 in
Row Spacing - Mating [x]	2.54 mm
Shrouding	Shrouded - 4 Wall
Style	Cable, Board to Board
Termination	Solder
Voltage Rating	300 VDC

XG4C Series

Part	Contact Finish Thickness - Post [custom]	Contact Finish Thickness - Post [custom]	Style	Contact Finish Thickness - Mating [custom]	Contact Finish Thickness - Mating [custom]	Contact Length - Post [x]	Contact Length - Post [x]	Connector Type	Insulation Material	Row Spacing - Mating [x]	Row Spacing - Mating [x]	Number of Rows [custom]	Operating Temperature [Min]	Operating Temperature [Max]	Number of Positions Loaded	Mounting Type	Insulation Color	Contact Material	Fastening Type	Contact Shape	Contact Finish - Mating	Contact Finish - Post	Contact Length - Mating [x]	Contact Length - Mating [x]	Pitch - Mating	Pitch - Mating	Material Flammability Rating	Number of Positions	Termination	Shrouding	Contact Type	Current Rating (Amps)	Voltage Rating	Features	Insulation Height	Insulation Height	Mated Stacking Heights	Overall Contact Length	Overall Contact Length	Number of Positions [custom]
Omron Electronics Inc-EMC Div XG4C-1074	78.7 µin	2 µm	Board to Board Cable	5.9 µin	0.15 µm	0.126 "	3.2 mm	Header	Polybutylene Terephthalate (PBT) Glass Filled	0.1 in	2.54 mm	2	-55 C	105 ░C	All	Right Angle Through Hole	Black	Brass Nickel	Push-Pull	Square	Gold	Tin	0.24 in	6.1 mm	0.1 "	2.54 mm	UL94 V-0	10	Solder	Shrouded - 4 Wall	Male Pin	3 A	300 VDC	Keying Slot	0.323 in	8.2 mm
Omron Electronics Inc-EMC Div XG4C-6074	78.7 µin	2 µm	Board to Board Cable	5.9 µin	0.15 µm	0.126 "	3.2 mm	Header	Polybutylene Terephthalate (PBT) Glass Filled	0.1 in	2.54 mm	2	-55 C	105 ░C	All	Right Angle Through Hole	Black	Brass Nickel	Push-Pull	Square	Gold	Tin	0.24 in	6.1 mm	0.1 "	2.54 mm	UL94 V-0	60	Solder	Shrouded - 4 Wall	Male Pin	3 A	300 VDC	Keying Slot	0.323 in	8.2 mm
Omron Electronics Inc-EMC Div XG4C-3431	78.7 µin	2 µm	Board to Board Cable	5.9 µin	0.15 µm	0.126 "	3.2 mm	Header	Polybutylene Terephthalate (PBT) Glass Filled	0.1 in	2.54 mm	2	-55 C	105 ░C	All	Through Hole	Black	Brass Nickel	Push-Pull	Square	Gold	Tin	0.24 in	6.1 mm	0.1 "	2.54 mm	UL94 V-0		Solder	Shrouded - 4 Wall	Male Pin	3 A	300 VDC	Keying Slot	0.335 "	8.51 mm	10.1 mm 19 mm 20.2 mm	0.48 in	12.19 mm	34
Omron Electronics Inc-EMC Div XG4C-5071	78.7 µin	2 µm	Board to Board Cable	5.9 µin	0.15 µm	0.126 "	3.2 mm	Header	Polybutylene Terephthalate (PBT) Glass Filled	0.1 in	2.54 mm	2	-55 C	105 ░C	All	Through Hole	Black	Brass Nickel	Push-Pull	Square	Gold	Tin	0.24 in	6.1 mm	0.1 "	2.54 mm	UL94 V-0	50	Solder	Shrouded - 4 Wall	Male Pin	3 A	300 VDC	Keying Slot	0.335 "	8.51 mm	10.1 mm 19 mm 20.2 mm	0.48 in	12.19 mm
Omron Electronics Inc-EMC Div XG4C-3031	78.7 µin	2 µm	Board to Board Cable	5.9 µin	0.15 µm	0.126 "	3.2 mm	Header	Polybutylene Terephthalate (PBT) Glass Filled	0.1 in	2.54 mm	2	-55 C	105 ░C	All	Through Hole	Black	Brass Nickel	Push-Pull	Square	Gold	Tin	0.24 in	6.1 mm	0.1 "	2.54 mm	UL94 V-0	30	Solder	Shrouded - 4 Wall	Male Pin	3 A	300 VDC	Keying Slot	0.335 "	8.51 mm	10.1 mm 19 mm 20.2 mm	0.48 in	12.19 mm
Omron Electronics Inc-EMC Div XG4C-5031	78.7 µin	2 µm	Board to Board Cable	5.9 µin	0.15 µm	0.126 "	3.2 mm	Header	Polybutylene Terephthalate (PBT) Glass Filled	0.1 in	2.54 mm	2	-55 C	105 ░C	All	Through Hole	Black	Brass Nickel	Push-Pull	Square	Gold	Tin	0.24 in	6.1 mm	0.1 "	2.54 mm	UL94 V-0	50	Solder	Shrouded - 4 Wall	Male Pin	3 A	300 VDC	Keying Slot	0.335 "	8.51 mm	10.1 mm 19 mm 20.2 mm	0.48 in	12.19 mm
Omron Electronics Inc-EMC Div XG4C-5014	78.7 µin	2 µm	Board to Board Cable	5.9 µin	0.15 µm			Header	Polybutylene Terephthalate (PBT) Glass Filled	0.1 in	2.54 mm		-55 C	105 ░C			Black	Brass	Push-Pull	Square	Gold	Tin			0.1 "	2.54 mm	UL94 V-0	50	Solder	Shrouded - 4 Wall	Male Pin	3 A	300 VDC
Omron Electronics Inc-EMC Div XG4C-4034	78.7 µin	2 µm	Board to Board Cable	5.9 µin	0.15 µm	0.126 "	3.2 mm	Header	Polybutylene Terephthalate (PBT) Glass Filled	0.1 in	2.54 mm	2	-55 C	105 ░C	All	Right Angle Through Hole	Black	Brass Nickel	Push-Pull	Square	Gold	Tin	0.24 in	6.1 mm	0.1 "	2.54 mm	UL94 V-0	40	Solder	Shrouded - 4 Wall	Male Pin	3 A	300 VDC	Keying Slot	0.323 in	8.2 mm
Omron Electronics Inc-EMC Div XG4C-3034	78.7 µin	2 µm	Board to Board Cable	5.9 µin	0.15 µm	0.126 "	3.2 mm	Header	Polybutylene Terephthalate (PBT) Glass Filled	0.1 in	2.54 mm	2	-55 C	105 ░C	All	Right Angle Through Hole	Black	Brass Nickel	Push-Pull	Square	Gold	Tin	0.24 in	6.1 mm	0.1 "	2.54 mm	UL94 V-0	30	Solder	Shrouded - 4 Wall	Male Pin	3 A	300 VDC	Keying Slot	0.323 in	8.2 mm
Omron Electronics Inc-EMC Div XG4C-2631	78.7 µin	2 µm	Board to Board Cable	5.9 µin	0.15 µm	0.126 "	3.2 mm	Header	Polybutylene Terephthalate (PBT) Glass Filled	0.1 in	2.54 mm	2	-55 C	105 ░C	All	Through Hole	Black	Brass Nickel	Push-Pull	Square	Gold	Tin	0.24 in	6.1 mm	0.1 "	2.54 mm	UL94 V-0	26	Solder	Shrouded - 4 Wall	Male Pin	3 A	300 VDC	Keying Slot	0.335 "	8.51 mm	10.1 mm 19 mm 20.2 mm	0.48 in	12.19 mm

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	N/A	0	$ 0.00