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8-SOIC
Integrated Circuits (ICs)

THS4500CD

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Texas Instruments

15V, HIGH-SPEED FULLY DIFFERENTIAL AMPLIFIER WITH POWER-DOWN

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8-SOIC
Integrated Circuits (ICs)

THS4500CD

Active
Texas Instruments

15V, HIGH-SPEED FULLY DIFFERENTIAL AMPLIFIER WITH POWER-DOWN

Technical Specifications

Parameters and characteristics for this part

SpecificationTHS4500CD
-3db Bandwidth370 MHz
Amplifier TypeDifferential
Current - Input Bias4 µA
Current - Supply23 mA
Gain Bandwidth Product300 MHz
Mounting TypeSurface Mount
Number of Circuits1
Operating Temperature [Max]70 °C
Operating Temperature [Min]0 °C
Output TypeDifferential
Package / Case8-SOIC
Package / Case [x]0.154 in
Package / Case [y]3.9 mm
Slew Rate2800 V/µs
Supplier Device Package8-SOIC
Voltage - Input Offset4 mV
Voltage - Supply Span (Max) [Max]15 V
Voltage - Supply Span (Min) [Min]4.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
ArrowN/A 75$ 6.15
DigikeyTube 150$ 8.24
Texas InstrumentsTUBE 1$ 8.75
100$ 7.64
250$ 5.89
1000$ 5.27

Description

General part information

THS4500 Series

The THS4500 and THS4501 are high-performance fully differential amplifiers from Texas Instruments. The THS4500, featuring power-down capability, and the THS4501, without power-down capability, set new performance standards for fully differential amplifiers with unsurpassed linearity, supporting 14-bit operation through 40 MHz. Package options include the SOIC-8 and the MSOP-8 with PowerPAD for a smaller footprint, enhanced ac performance, and improved thermal dissipation capability.

The THS4500 and THS4501 are high-performance fully differential amplifiers from Texas Instruments. The THS4500, featuring power-down capability, and the THS4501, without power-down capability, set new performance standards for fully differential amplifiers with unsurpassed linearity, supporting 14-bit operation through 40 MHz. Package options include the SOIC-8 and the MSOP-8 with PowerPAD for a smaller footprint, enhanced ac performance, and improved thermal dissipation capability.