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Discrete Semiconductor Products

UM2222AU3HZGT106

Active
Rohm Semiconductor

NPN, SOT-323, 40V 0.6A, MEDIUM POWER TRANSISTOR FOR SWITCHING FOR AUTOMOTIVE

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Product dimension image
Discrete Semiconductor Products

UM2222AU3HZGT106

Active
Rohm Semiconductor

NPN, SOT-323, 40V 0.6A, MEDIUM POWER TRANSISTOR FOR SWITCHING FOR AUTOMOTIVE

Technical Specifications

Parameters and characteristics for this part

SpecificationUM2222AU3HZGT106
Current - Collector (Ic) (Max) [Max]600 mA
Current - Collector Cutoff (Max) [Max]100 nA
DC Current Gain (hFE) (Min) @ Ic, Vce [Min]100 hFE
GradeAutomotive
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseSOT-323, SC-70
Power - Max [Max]200 mW
QualificationAEC-Q101
Supplier Device PackageUMT3
Vce Saturation (Max) @ Ib, Ic1 V
Voltage - Collector Emitter Breakdown (Max) [Max]40 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.43
10$ 0.27
100$ 0.17
500$ 0.12
1000$ 0.11
Digi-Reel® 1$ 0.43
10$ 0.27
100$ 0.17
500$ 0.12
1000$ 0.11
N/A 1096$ 0.43
Tape & Reel (TR) 3000$ 0.07
6000$ 0.06
NewarkEach (Supplied on Cut Tape) 1$ 0.45
10$ 0.27
25$ 0.23
50$ 0.18
100$ 0.13
250$ 0.12
500$ 0.11
1000$ 0.10

Description

General part information

UM2222AU3HZG Series

UM2222AU3HZG is a transistor for audio frequency small signal amplifier. Complementary is the UM2907A HZG

Documents

Technical documentation and resources

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

UM2222AU3HZG Data Sheet

Data Sheet

What is a Thermal Model? (Transistor)

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Taping Information

Package Information

How to Use LTspice® Models

Schematic Design & Verification

What Is Thermal Design

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Explanation for Marking

Package Information

Moisture Sensitivity Level - Transistors

Package Information

Two-Resistor Model for Thermal Simulation

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Package Dimensions

Package Information

About Flammability of Materials

Environmental Data

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Reliability Test Result

Manufacturing Data

Anti-Whisker formation - Transistors

Package Information

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

About Export Regulations

Export Information

Compliance of the RoHS directive

Environmental Data

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

List of Transistor Package Thermal Resistance

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Condition of Soldering / Land Pattern Reference

Package Information

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Part Explanation

Application Note

Types and Features of Transistors

Application Note