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Discrete Semiconductor Products

RFN1LAM6STFTR

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Rohm Semiconductor

AUTOMOTIVE FAST RECOVERY DIODE (AEC-Q101 QUALIFIED)

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Product dimension image
Discrete Semiconductor Products

RFN1LAM6STFTR

Active
Rohm Semiconductor

AUTOMOTIVE FAST RECOVERY DIODE (AEC-Q101 QUALIFIED)

Technical Specifications

Parameters and characteristics for this part

SpecificationRFN1LAM6STFTR
Current - Average Rectified (Io)800 mA
Current - Reverse Leakage @ Vr1 µA
GradeAutomotive
Mounting TypeSurface Mount
Operating Temperature - Junction [Max]150 °C
Package / CaseSOD-128
QualificationAEC-Q101
Reverse Recovery Time (trr)35 ns
Speed500 ns, 200 mA
Supplier Device PackagePMDTM
TechnologyStandard
Voltage - DC Reverse (Vr) (Max) [Max]600 V
Voltage - Forward (Vf) (Max) @ If1.45 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 11488$ 0.52
MouserN/A 1$ 0.50
10$ 0.40
100$ 0.26
500$ 0.19
1000$ 0.17
3000$ 0.15
6000$ 0.14
9000$ 0.13
NewarkEach (Supplied on Full Reel) 3000$ 0.12
6000$ 0.12
12000$ 0.11

Description

General part information

RFN1LAM6STF Series

RFN1LAM6STF is the high reliability Automotive Fast Recovery Diode, suitable for general rectification.

Documents

Technical documentation and resources

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

ESD Data

Characteristics Data

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Part Explanation

Application Note

Compliance of the RoHS directive

Environmental Data

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

About Flammability of Materials

Environmental Data

Diode Types and Applications

Technical Article

List of Diode Package Thermal Resistance

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Inner Structure

Package Information

Judgment Criteria of Thermal Evaluation

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

How to Create Symbols for PSpice Models

Models

What Is Thermal Design

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Reliability Test Result

Manufacturing Data

PCB Layout Thermal Design Guide

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Report of SVHC under REACH Regulation

Environmental Data

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

How to Use LTspice&reg; Models

Schematic Design & Verification

Anti-Whisker formation - Diodes

Package Information

Explanation for Marking

Package Information

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Taping Information

Package Information

Moisture Sensitivity Level - Diodes

Package Information

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

How to Select Rectifier Diodes

Technical Article

Package Dimensions

Package Information

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

RFN1LAM6STF Data Sheet

Data Sheet

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

What is a Thermal Model? (Diode)

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

About Export Regulations

Export Information

Power Loss and Thermal Design of Diodes

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Product Change Notice EN

Datasheet