Integrated Circuits (ICs)

74AUC2G125DCURG4

Unknown

IC BUFFER NON-INVERT 2.7V 8VSSOP

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Integrated Circuits (ICs)

Unknown

IC BUFFER NON-INVERT 2.7V 8VSSOP

Technical Specifications

Parameters and characteristics for this part

Specification	74AUC2G125DCURG4

Current - Output High, Low [custom]	9 mA
Current - Output High, Low [custom]	9 mA
Logic Type	Buffer, Non-Inverting
Mounting Type	Surface Mount
Number of Bits per Element	1
Number of Elements	2
Operating Temperature [Max]	85 °C
Operating Temperature [Min]	-40 °C
Output Type	3-State
Package / Case	8-VFSOP
Package / Case [y]	2.3 mm
Package / Case [y]	0.091 in
Voltage - Supply [Max]	2.7 V
Voltage - Supply [Min]	0.8 V

2-ch, 0.8-V to 2.7-V high speed buffers with 3-state outputs

Part	Logic Type	Voltage - Supply [Max]	Voltage - Supply [Min]	Number of Bits per Element	Output Type	Number of Elements	Supplier Device Package	Mounting Type	Current - Output High, Low [custom]	Current - Output High, Low [custom]	Operating Temperature [Max]	Operating Temperature [Min]	Package / Case	Package / Case [y]	Package / Case [y]
Texas Instruments SN74AUC2G125DCTR	Buffer Non-Inverting	2.7 V	0.8 V	1	3-State	2	SM8	Surface Mount	9 mA	9 mA	85 °C	-40 °C
Texas Instruments SN74AUC2G125YZPR	Buffer Non-Inverting	2.7 V	0.8 V	1	3-State	2	8-DSBGA	Surface Mount	9 mA	9 mA	85 °C	-40 °C	8-XFBGA DSBGA
Texas Instruments SN74AUC2G125DCUR	Buffer Non-Inverting	2.7 V	0.8 V	1	3-State	2		Surface Mount	9 mA	9 mA	85 °C	-40 °C	8-VFSOP	2.3 mm	0.091 in
Texas Instruments 74AUC2G125DCURG4	Buffer Non-Inverting	2.7 V	0.8 V	1	3-State	2		Surface Mount	9 mA	9 mA	85 °C	-40 °C	8-VFSOP	2.3 mm	0.091 in

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

This dual bus buffer gate is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V VCCoperation.

The SN74AUC2G125 features dual line drivers with 3-state outputs. The outputs are disabled when the associated output-enable (OE) input is high.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

Technical documentation and resources

No documents available