Parameters and characteristics for this part
| Specification | 232-1271-00-1102JH |
|---|---|
| Contact Resistance | 25 mOhm |
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
General part information
Pos Socket
Technical documentation and resources
| Part | Thickness | Thickness | Thickness | Backing, Carrier | Tape Type | Storage/Refrigeration Temperature | Storage/Refrigeration Temperature | Width [y] | Width [y] | Usage | Length | Length | Length | Shelf Life Start | Adhesive | Shelf Life | Color | Contact Material - Post | Number of Positions or Pins (Grid) | Type | Termination | Features | Contact Resistance | Housing Material | Contact Material - Mating | Contact Finish - Mating | Contact Finish - Post | Mounting Type | Termination Post Length [x] | Termination Post Length [x] | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Material Flammability Rating | Type | Type | Pitch - Mating | Pitch - Mating | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Pitch - Post | Pitch - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Current Rating (Amps) | Operating Temperature [Min] | Operating Temperature [Max] | Termination Post Length | Termination Post Length | Width [x] | Width [x] | Number of Positions or Pins (Grid) [custom] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 3M (TC) | 6.3 mils | 0.0063 " | 0.16 mm | Crepe Paper Treated | Masking | 70 °F | 21 °C | 48 mm | 1.89 in | Medium Temp Paint Bake | 60 yds | 55 m | 180 ft | Date of Manufacture | Rubber | 12 Months | Tan | ||||||||||||||||||||||||||||||||||
 3M (TC) | Beryllium Copper | 32 | QFN | Solder | Closed Frame | 25 mOhm | Polyethersulfone (PES) | Beryllium Copper | Gold | Gold | Through Hole | 2.9 mm | 0.114 in | ||||||||||||||||||||||||||||||||||||||
 3M (TC) | Beryllium Copper | DIP ZIF (ZIP) | Press-Fit | Closed Frame | 15 mOhm | Polysulfone (PSU) Glass Filled | Beryllium Copper | Gold | Gold | Connector | 30 Áin | 0.76 Ám | UL94 V-0 | 15.24 mm | 0.6 " | 0.1 in | 2.54 mm | 2 x 16 | 32 | 2.54 mm | 0.1 in | 30 µin | 0.76 µm | 1 A | -55 °C | 125 °C | 0.11 in | 2.78 mm | |||||||||||||||||||||||
3M (TC) | 25 mOhm | ||||||||||||||||||||||||||||||||||||||||||||||||||
 3M (TC) | 6.3 mils | 0.0063 " | 0.16 mm | Crepe Paper Treated | Masking | 70 °F | 21 °C | Medium Temp Paint Bake | 60 yds | 55 m | 180 ft | Date of Manufacture | Rubber | 12 Months | Tan | 3.78 " | 96 mm | ||||||||||||||||||||||||||||||||||
 3M (TC) | Beryllium Copper | SIP ZIF (ZIP) | Solder | Polysulfone (PSU) Glass Filled | Beryllium Copper | Gold | Gold | Through Hole | UL94 V-0 | 0.1 in | 2.54 mm | 1 x 32 | 2.54 mm | 0.1 in | 30 µin | 0.76 µm | 1 A | -55 °C | 125 °C | 0.13 in | 3.3 mm | 32 | |||||||||||||||||||||||||||||
 3M (TC) | Beryllium Copper | DIP ZIF (ZIP) | Press-Fit | Closed Frame | Polysulfone (PSU) Glass Filled | Beryllium Copper | Gold | Gold | Connector | 30 Áin | 0.76 Ám | UL94 V-0 | 15.24 mm | 0.6 " | 0.1 in | 2.54 mm | 2 x 16 | 32 | 2.54 mm | 0.1 in | 30 µin | 0.76 µm | 1 A | -55 °C | 125 °C | 0.11 in | 2.78 mm | ||||||||||||||||||||||||
3M (TC) | 25 mOhm | ||||||||||||||||||||||||||||||||||||||||||||||||||
3M (TC) | 25 mOhm | ||||||||||||||||||||||||||||||||||||||||||||||||||
3M (TC) | 6.3 mils | 0.0063 " | 0.16 mm | Crepe Paper Treated | Masking | 70 °F | 21 °C | Medium Temp Paint Bake | 60 yds | 55 m | 180 ft | Date of Manufacture | Rubber | 12 Months | Tan | 0.47 in | 12 mm |