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TPSM53602EVM
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TPSM53602EVM

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Texas Instruments

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TPSM53602EVM
Development Boards, Kits, Programmers

TPSM53602EVM

Active
Texas Instruments

EVAL BOARD FOR TPSM53602

Deep-Dive with AI

DocumentsDatasheet

Technical Specifications

Parameters and characteristics for this part

SpecificationTPSM53602EVM
Board TypeFully Populated
ContentsBoard(s)
Current - Output2 A
Main PurposeDC/DC, Step Down
Outputs and Type1
Outputs and TypeNon-Isolated, 1 Non-Isolated Output
Regulator TopologyBuck
Supplied ContentsBoard(s)
Utilized IC / PartTPSM53602
Voltage - Input [Max]36 V
Voltage - Input [Min]3.8 V
Voltage - Output1.2 V, 5 V, 2.5 V, 3.3 V, 1.8 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBox 1$ 58.80
N/A 6$ 58.80

Description

General part information

TPSM53602 Series

The TPSM53602 power module is a highly integrated 2-A power solution that combines a 36-V input, step-down, DC/DC converter with power MOSFETs, a shielded inductor, and passives in a thermally-enhanced QFN package. The 5-mm x 5.5-mm x 4-mm, 15-pin package usesEnhanced HotRod QFNtechnology for improved thermal performance, small footprint, and low EMI. The package footprint has all pins accessible from the perimeter and a single large thermal pad for simple layout and easy handling in manufacturing.

The total solution requires as few as four external components and eliminates the loop compensation and magnetics part selection from the design process. The full feature set includes power good, programmable UVLO, prebias start-up, overcurrent, and overtemperature protections, making the TPSM53602 an excellent device for powering a wide range of applications.

The TPSM53602 power module is a highly integrated 2-A power solution that combines a 36-V input, step-down, DC/DC converter with power MOSFETs, a shielded inductor, and passives in a thermally-enhanced QFN package. The 5-mm x 5.5-mm x 4-mm, 15-pin package usesEnhanced HotRod QFNtechnology for improved thermal performance, small footprint, and low EMI. The package footprint has all pins accessible from the perimeter and a single large thermal pad for simple layout and easy handling in manufacturing.

Documents

Technical documentation and resources