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Technical Specifications
Parameters and characteristics for this part
| Specification | TPSM53602EVM |
|---|---|
| Board Type | Fully Populated |
| Contents | Board(s) |
| Current - Output | 2 A |
| Main Purpose | DC/DC, Step Down |
| Outputs and Type | 1 |
| Outputs and Type | Non-Isolated, 1 Non-Isolated Output |
| Regulator Topology | Buck |
| Supplied Contents | Board(s) |
| Utilized IC / Part | TPSM53602 |
| Voltage - Input [Max] | 36 V |
| Voltage - Input [Min] | 3.8 V |
| Voltage - Output | 1.2 V, 5 V, 2.5 V, 3.3 V, 1.8 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Box | 1 | $ 58.80 | |
| N/A | 6 | $ 58.80 | ||
Description
General part information
TPSM53602 Series
The TPSM53602 power module is a highly integrated 2-A power solution that combines a 36-V input, step-down, DC/DC converter with power MOSFETs, a shielded inductor, and passives in a thermally-enhanced QFN package. The 5-mm x 5.5-mm x 4-mm, 15-pin package usesEnhanced HotRod QFNtechnology for improved thermal performance, small footprint, and low EMI. The package footprint has all pins accessible from the perimeter and a single large thermal pad for simple layout and easy handling in manufacturing.
The total solution requires as few as four external components and eliminates the loop compensation and magnetics part selection from the design process. The full feature set includes power good, programmable UVLO, prebias start-up, overcurrent, and overtemperature protections, making the TPSM53602 an excellent device for powering a wide range of applications.
The TPSM53602 power module is a highly integrated 2-A power solution that combines a 36-V input, step-down, DC/DC converter with power MOSFETs, a shielded inductor, and passives in a thermally-enhanced QFN package. The 5-mm x 5.5-mm x 4-mm, 15-pin package usesEnhanced HotRod QFNtechnology for improved thermal performance, small footprint, and low EMI. The package footprint has all pins accessible from the perimeter and a single large thermal pad for simple layout and easy handling in manufacturing.
Documents
Technical documentation and resources