Specification	MSP430FR5041IPM

Connectivity	IrDA, I2C, SPI
Core Processor	MSP430 CPUXV2
Core Size	16-Bit
Data Converters	A/D 9x12b SAR
Mounting Type	Surface Mount
Number of I/O	44
Operating Temperature [Max]	85 °C
Operating Temperature [Min]	-40 °C
Oscillator Type	Internal
Package / Case	64-LQFP
Program Memory Size	32 KB
Program Memory Type	FRAM
RAM Size	12 K
Speed	16 MHz
Supplier Device Package	64-LQFP (10x10)
Voltage - Supply (Vcc/Vdd) [Max]	3.6 V
Voltage - Supply (Vcc/Vdd) [Min]	1.8 V

MSP430FR5041 Series

16-MHz MCU with 32 KB FRAM, 12-bit high speed 8 MSPS sigma-delta ADC and integrated sensor AFE

Part	Supplier Device Package	Speed	RAM Size	Package / Case	Oscillator Type	Program Memory Size	Core Processor	Program Memory Type	Operating Temperature [Max]	Operating Temperature [Min]	Mounting Type	Number of I/O	Data Converters	Voltage - Supply (Vcc/Vdd) [Min]	Voltage - Supply (Vcc/Vdd) [Max]	Core Size	Connectivity
Texas Instruments MSP430FR5041IRGCT	64-VQFN (9x9)	16 MHz	12 K	64-VFQFN Exposed Pad	Internal	32 KB	MSP430 CPUXV2	FRAM	85 °C	-40 °C	Surface Mount	44	A/D 9x12b SAR	1.8 V	3.6 V	16-Bit	I2C IrDA SPI
Texas Instruments MSP430FR5041IPM	64-LQFP (10x10)	16 MHz	12 K	64-LQFP	Internal	32 KB	MSP430 CPUXV2	FRAM	85 °C	-40 °C	Surface Mount	44	A/D 9x12b SAR	1.8 V	3.6 V	16-Bit	I2C IrDA SPI

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tray	160	$ 6.94
Texas Instruments	JEDEC TRAY (10+1)	1	$ 7.10
		100	$ 5.79
		250	$ 4.55
		1000	$ 3.86

Description

General part information

MSP430FR5041 Series

The Texas Instruments MSP430FR604x and MSP430FR504x SoCs are part of theMSP430 ultrasonic sensing microcontroller(MCU) family and are powerful, highly integrated devices designed for a wide variety of industrial applications:

These MCUs offer an integrated ultrasonic sensing solution (USS_A) module, which provides high accuracy for a wide range of flow rates. The USS module helps achieve ultra-low-power metering combined with lower system cost due to maximum integration requiring very few external components.

MSP430FR604x and MSP430FR504x devices implement high-speed ADC-based signal acquisition followed by optimized digital signal processing using the low-energy accelerator (LEA) to deliver a high-accuracy metering solution with ultra-low power optimum for battery-powered metering applications.