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8-VSON
Integrated Circuits (ICs)

BQ500101DPCT

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Texas Instruments

IC HALF BRIDGE DRIVER 10A 8VSON

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8-VSON
Integrated Circuits (ICs)

BQ500101DPCT

Active
Texas Instruments

IC HALF BRIDGE DRIVER 10A 8VSON

Technical Specifications

Parameters and characteristics for this part

SpecificationBQ500101DPCT
ApplicationsSynchronous Buck Converters
Current - Output / Channel10 A
Current - Peak Output15 A
Fault ProtectionShoot-Through
FeaturesBootstrap Circuit
InterfacePWM
Load TypeInductive
Mounting TypeSurface Mount
Operating Temperature [Max]150 °C
Operating Temperature [Min]-40 °C
Package / Case8-PowerVFDFN
Supplier Device Package8-VSON (3.5x4.5)
TechnologyPower MOSFET
Voltage - Supply [Max]5.5 V
Voltage - Supply [Min]4.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 2.11
10$ 1.89
25$ 1.79
100$ 1.52
Digi-Reel® 1$ 2.11
10$ 1.89
25$ 1.79
100$ 1.52
Tape & Reel (TR) 250$ 1.43
500$ 1.25
1250$ 1.04
2500$ 0.96
6250$ 0.93
Texas InstrumentsSMALL T&R 1$ 1.58
100$ 1.31
250$ 0.94
1000$ 0.71

Description

General part information

BQ500101 Series

The bq500101 NexFET Power Stage is optimized for wireless power applications covering the WPC v1.2 medium power specification. The device can be used for both the rail voltage control in fixed frequency transmitter types as well as the coil drivers for both fixed and variable frequency types. This combination produces a high-current, high-efficiency, and high-speed switching device in a small 3.5 × 4.5 mm outline package. In addition, the PCB footprint is optimized to help reduce design time and simplify the completion of the overall system design.

The bq500101 NexFET Power Stage is optimized for wireless power applications covering the WPC v1.2 medium power specification. The device can be used for both the rail voltage control in fixed frequency transmitter types as well as the coil drivers for both fixed and variable frequency types. This combination produces a high-current, high-efficiency, and high-speed switching device in a small 3.5 × 4.5 mm outline package. In addition, the PCB footprint is optimized to help reduce design time and simplify the completion of the overall system design.