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ROHM DTC143TETL
Discrete Semiconductor Products

RU1L002SNTL

Active
Rohm Semiconductor

POWER MOSFET, N CHANNEL, 60 V, 250 MA, 1.7 OHM, SOT-323FL, SURFACE MOUNT

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ROHM DTC143TETL
Discrete Semiconductor Products

RU1L002SNTL

Active
Rohm Semiconductor

POWER MOSFET, N CHANNEL, 60 V, 250 MA, 1.7 OHM, SOT-323FL, SURFACE MOUNT

Technical Specifications

Parameters and characteristics for this part

SpecificationRU1L002SNTL
Current - Continuous Drain (Id) @ 25°C250 mA
Drain to Source Voltage (Vdss)60 V
Drive Voltage (Max Rds On, Min Rds On)10 V, 2.5 V
FET TypeN-Channel
Input Capacitance (Ciss) (Max) @ Vds15 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseSC-85
Power Dissipation (Max)200 mW
Rds On (Max) @ Id, Vgs2.4 Ohm
Supplier Device PackageUMT3F
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max) @ Id2.3 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 11103$ 0.30

Description

General part information

RU1L002SN Series

MOSFETs are made as ultra-low ON-resistance by the micro-processing technologies suitable for mobile equipment for low current consumption. In wide lineup including compact type, high-power type and complex type to meet in the market.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Taping Information

Package Information

How to Create Symbols for PSpice Models

Models

Compliance of the RoHS directive

Environmental Data

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

How to Use LTspice® Models

Schematic Design & Verification

Condition of Soldering / Land Pattern Reference

Package Information

What is a Thermal Model? (Transistor)

Thermal Design

Certificate of not containing SVHC under REACH Regulation

Environmental Data

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Reliability Test Result

Manufacturing Data

Package Dimensions

Package Information

Types and Features of Transistors

Application Note

Anti-Whisker formation - Transistors

Package Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Method for Monitoring Switching Waveform

Schematic Design & Verification

What Is Thermal Design

Thermal Design

Inner Structure

Package Information

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

About Export Regulations

Export Information

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

ESD Data

Characteristics Data

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Part Explanation

Application Note

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Explanation for Marking

Package Information

PCB Layout Thermal Design Guide

Thermal Design

Moisture Sensitivity Level - Transistors

Package Information

About Flammability of Materials

Environmental Data

List of Transistor Package Thermal Resistance

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article