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Isolators

BM61S41RFV-CE2

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Rohm Semiconductor

ISOLATION VOLTAGE 3750 VRMS 1CH GATE DRIVER PROVIDING GALVANIC ISOLATION

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Isolators

BM61S41RFV-CE2

Active
Rohm Semiconductor

ISOLATION VOLTAGE 3750 VRMS 1CH GATE DRIVER PROVIDING GALVANIC ISOLATION

Technical Specifications

Parameters and characteristics for this part

SpecificationBM61S41RFV-CE2
Approval AgencyUL
Common Mode Transient Immunity (Min) [Min]100 V/ns
Current - Output High, Low [custom]4 A
Current - Output High, Low [custom]4 A
GradeAutomotive
Mounting TypeSurface Mount
Number of Channels [custom]1
Operating Temperature [Max]125 °C
Operating Temperature [Min]-40 C
Package / Case8 mm
Package / Case0.315 in
Package / Case10-SSOP
Propagation Delay tpLH / tpHL (Max)65 ns
Pulse Width Distortion (Max) [Max]60 ns
QualificationAEC-Q100
Rise / Fall Time (Typ) [custom]15 ns
Rise / Fall Time (Typ) [custom]15 ns
Supplier Device Package10-SSOP-BW
TechnologyMagnetic Coupling
Voltage - Isolation3750 Vrms
Voltage - Output Supply [Max]24 V
Voltage - Output Supply [Min]16 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 3.49
10$ 3.14
25$ 2.97
100$ 2.57
250$ 2.44
500$ 2.32
Digi-Reel® 1$ 3.49
10$ 3.14
25$ 2.97
100$ 2.57
250$ 2.44
500$ 2.32
N/A 14957$ 4.58
Tape & Reel (TR) 1500$ 2.32
NewarkEach (Supplied on Cut Tape) 1$ 6.31
10$ 4.16
25$ 3.60
50$ 3.28
100$ 2.95
250$ 2.65
500$ 2.45

Description

General part information

BM61S41RFV-C Series

The BM61S41RFV-C is a gate driver with an isolation voltage of 3750 Vrms, I/O delay time of 65 ns, and minimum input pulse width of 60 ns. It has the Under-Voltage Lockout (UVLO) function and Miller clamp function.

Documents

Technical documentation and resources

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Solder Joint Rate and Thermal Resistance of Exposed Pad

Thermal Design

Heat Dissipation Effect of Thermal Via in Exposed Pad Type Package

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Factory Information

Manufacturing Data

Five Steps for Successful Thermal Design of IC

White Paper

Cutting-Edge Web Simulation Tool "ROHM Solution Simulator" Capable of Complete Circuit Verification of Power Devices and Driver ICs

White Paper

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

What Is Thermal Design

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

PCB Layout Thermal Design Guide

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Gate Driver BM61S41RFV-C Evaluation Board BM61S41RFV-EVK001

User's Guide

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

The Problem with Traditional Vaccine Storage Freezers and How ROHM Cutting-edge Power Solutions Can Take them to the Next Level

White Paper

Thermal Resistance

Thermal Design

BM61S41RFV-C Spice Modeling Report

Models

How to Use the Two-Resistor Model

Thermal Design

ROHM Solution Simulator Power Device User's Guide for Inverter

Simulations

Design Guide and Example of Stencil for Exposed Pad

Thermal Design

BM61S41RFV-C Data Sheet

Data Sheet

Judgment Criteria of Thermal Evaluation

Thermal Design

SSOP-B10W Package Information

Package Information

Gate Driver BM61S41RFV-C Evaluation Board BM61S41RFV-EVK002

User's Guide