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R6014YNX3C16
Discrete Semiconductor Products

R6530KNX3C16

Active
Rohm Semiconductor

650V 30A, TO-220AB, HIGH-SPEED SWITCHING POWER MOSFET

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Search across all available documentation for this part.

DocumentsAbout Export RegulationsR6530KNX3 ESD Data+30
R6014YNX3C16
Discrete Semiconductor Products

R6530KNX3C16

Active
Rohm Semiconductor

650V 30A, TO-220AB, HIGH-SPEED SWITCHING POWER MOSFET

Deep-Dive with AI

DocumentsAbout Export RegulationsR6530KNX3 ESD Data+30

Technical Specifications

Parameters and characteristics for this part

SpecificationR6530KNX3C16
Current - Continuous Drain (Id) @ 25°C30 A
Drain to Source Voltage (Vdss)650 V
Drive Voltage (Max Rds On, Min Rds On)10 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs56 nC
Input Capacitance (Ciss) (Max) @ Vds2350 pF
Mounting TypeThrough Hole
Operating Temperature150 °C
Package / CaseTO-220-3
Power Dissipation (Max)307 W
Rds On (Max) @ Id, Vgs140 mOhm
Supplier Device PackageTO-220AB
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max) @ Id5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTube 1$ 2.08
50$ 1.67
100$ 1.38
500$ 1.24
NewarkEach 1$ 3.43
10$ 3.17
25$ 2.96
50$ 2.87
100$ 2.69

Description

General part information

R6530KNZ4 Series

The R6xxxKNx series are high-speed switching products, Super Junction MOSFETs, that place an emphasis on high efficiency. This series products achieve higher efficiency via high-speed switching. High-speed switching makes it possible to contribute to higher efficiency in PFC and LLC circuits.

Documents

Technical documentation and resources

About Export Regulations

Export Information

R6530KNX3 ESD Data

Characteristics Data

Notes for Temperature Measurement Using Thermocouples

Thermal Design

What Is Thermal Design

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

TO-220AB Reliability Test Result

Manufacturing Data

Types and Features of Transistors

Application Note

R6530KNX3 Data Sheet

Data Sheet

List of Transistor Package Thermal Resistance

Thermal Design

Moisture Sensitivity Level - Transistors

Package Information

Method for Monitoring Switching Waveform

Schematic Design & Verification

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

About Flammability of Materials

Environmental Data

Part Explanation

Application Note

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

Report of SVHC under REACH Regulation

Environmental Data

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

TO-220AB Inner Structure

Package Information

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

TO-220AB Explanation for Marking

Package Information

What is a Thermal Model? (Transistor)

Thermal Design