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RBR1LAM30ATR
Discrete Semiconductor Products

RBR1LAM30ATR

Active
Rohm Semiconductor

LOW VF, 30V, 1A, SOD-128, SCHOTTKY BARRIER DIODE

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RBR1LAM30ATR
Discrete Semiconductor Products

RBR1LAM30ATR

Active
Rohm Semiconductor

LOW VF, 30V, 1A, SOD-128, SCHOTTKY BARRIER DIODE

Technical Specifications

Parameters and characteristics for this part

SpecificationRBR1LAM30ATR
Current - Average Rectified (Io)1 A
Current - Reverse Leakage @ Vr50 µA
Mounting TypeSurface Mount
Operating Temperature - Junction [Max]150 °C
Package / CaseSOD-128
Speed500 ns, 200 mA
Supplier Device PackagePMDTM
TechnologySchottky
Voltage - DC Reverse (Vr) (Max) [Max]30 V
Voltage - Forward (Vf) (Max) @ If480 mV

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 197$ 0.58
NewarkEach (Supplied on Cut Tape) 1$ 0.58
10$ 0.36
25$ 0.32
50$ 0.28
100$ 0.24
250$ 0.22
500$ 0.20
1000$ 0.17

Description

General part information

RBR1LAM30A Series

RBR1LAM30A is Low VFSchottky Barrier Diode for General rectification.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

RBR1LAM30A Data Sheet

Data Sheet

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Diode Types and Applications

Technical Article

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

ROHM's SBD Lineup Contributes to Greater Miniaturization and Lower Loss in Automotive, Industrial, and Consumer Equipment

White Paper

Part Explanation

Application Note

Diode Selection Method for Asynchronous Converter

Schematic Design & Verification

How to Use LTspice® Models

Schematic Design & Verification

ESD Data

Characteristics Data

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

How to Create Symbols for PSpice Models

Models

Power Loss and Thermal Design of Diodes

Thermal Design

Inner Structure

Package Information

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Report of SVHC under REACH Regulation

Environmental Data

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Explanation for Marking

Package Information

About Flammability of Materials

Environmental Data

Notes for Temperature Measurement Using Thermocouples

Thermal Design

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

PCB Layout Thermal Design Guide

Thermal Design

List of Diode Package Thermal Resistance

Thermal Design

Reliability Test Result

Manufacturing Data

What Is Thermal Design

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

Constitution Materials List

Environmental Data

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

How to Select Rectifier Diodes

Technical Article

Compliance of the RoHS directive

Environmental Data

About Export Regulations

Export Information

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

Anti-Whisker formation - Diodes

Package Information

Moisture Sensitivity Level - Diodes

Package Information

What is a Thermal Model? (Diode)

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

Package Dimensions

Package Information

Taping Information

Package Information