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UDZVTE-1739B
Discrete Semiconductor Products

UDZVTE-1739B

Active
Rohm Semiconductor

200MW 39V, SOD-323FL, ZENER DIODE

Deep-Dive with AI

Search across all available documentation for this part.

DocumentsNotes for Calculating Power Consumption:Static OperationAbout Flammability of Materials+46
UDZVTE-1739B
Discrete Semiconductor Products

UDZVTE-1739B

Active
Rohm Semiconductor

200MW 39V, SOD-323FL, ZENER DIODE

Deep-Dive with AI

DocumentsNotes for Calculating Power Consumption:Static OperationAbout Flammability of Materials+46

Technical Specifications

Parameters and characteristics for this part

SpecificationUDZVTE-1739B
Mounting TypeSurface Mount
Operating Temperature [Max]150 °C
Operating Temperature [Min]-55 C
Package / CaseSC-90, SOD-323F
Power - Max [Max]200 mW
Supplier Device PackageUMD2
Voltage - Zener (Nom) (Vz)39 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 2578$ 0.23

Description

General part information

UDZV39B Series

ROHM's zener diodes are available in various lineup as 2-pin mold surface mount type and complex type.

Documents

Technical documentation and resources

Notes for Calculating Power Consumption:Static Operation

Thermal Design

About Flammability of Materials

Environmental Data

UDZV39B Data Sheet

Data Sheet

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

What is a Thermal Model? (Diode)

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Small-Signal Discrete Devices Zener Diodes(Long-Selling Products) - EDZV, UDZV

Catalog

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

Judgment Criteria of Thermal Evaluation

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Diode Types and Applications

Technical Article

About Export Regulations

Export Information

How to Use LTspice® Models

Schematic Design & Verification

Part Explanation

Application Note

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

List of Diode Package Thermal Resistance

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

ESD Data

Characteristics Data

How to Create Symbols for PSpice Models

Models

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Anti-Whisker formation - Diodes

Package Information

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Low-Side Current Sensing Circuit Design

Schematic Design & Verification

What Is Thermal Design

Thermal Design

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

Inner Structure

Package Information

Selection Method and Usage of TVS Diodes

Technical Article

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Package Dimensions

Package Information

Differences between TVS and Zener Diodes

Technical Article

What Are TVS Diodes?

Technical Article

Moisture Sensitivity Level - Diodes

Package Information

PCB Layout Thermal Design Guide

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Reliability Test Result

Manufacturing Data

Taping Information

Package Information

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

PCB Layout for TVS Diodes

Schematic Design & Verification

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Power Loss and Thermal Design of Diodes

Thermal Design

Compliance of the RoHS directive

Environmental Data

Explanation for Marking

Package Information

Condition of Soldering / Land Pattern Reference

Package Information