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X2SON (DSF)
Integrated Circuits (ICs)

SN74AUP2G17DSFR

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Texas Instruments

SCHMITT TRIGGER 1 4MA 0.8V~3.6V 4MA 2 SON-6(1X1) BUFFERS, DRIVERS, RECEIVERS, TRANSCEIVERS ROHS

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X2SON (DSF)
Integrated Circuits (ICs)

SN74AUP2G17DSFR

Active
Texas Instruments

SCHMITT TRIGGER 1 4MA 0.8V~3.6V 4MA 2 SON-6(1X1) BUFFERS, DRIVERS, RECEIVERS, TRANSCEIVERS ROHS

Technical Specifications

Parameters and characteristics for this part

SpecificationSN74AUP2G17DSFR
Current - Output High, Low [custom]4 mA
Current - Output High, Low [custom]4 mA
Input TypeSchmitt Trigger
Logic TypeBuffer, Non-Inverting
Mounting TypeSurface Mount
Number of Bits per Element1
Number of Elements2
Operating Temperature [Max]85 °C
Operating Temperature [Min]-40 °C
Output TypePush-Pull
Package / Case6-XFDFN
Supplier Device Package6-SON (1x1)
Voltage - Supply [Max]3.6 V
Voltage - Supply [Min]0.8 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 1.23
Digi-Reel® 1$ 1.23
Tape & Reel (TR) 5000$ 0.26
LCSCPiece 1$ 0.45
10$ 0.34
30$ 0.29
100$ 0.23
500$ 0.20
1000$ 0.17
Texas InstrumentsLARGE T&R 1$ 0.58
100$ 0.40
250$ 0.31
1000$ 0.20

Description

General part information

SN74AUP2G17 Series

The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCCrange of 0.8 V to 3.6 V, resulting in increased battery life (see Figure 1). This product also maintains excellent signal integrity (see the very low undershoot and overshoot characteristics shown in Figure 2).

The SN74AUP2G17 contains two buffers and performs the Boolean function Y = A. The device functions as two independent buffers, but because of Schmitt action, it may have different input threshold levels for positive-going (VT+) and negative-going (VT–) signals.

NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.