Deep-Dive with AI
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Deep-Dive with AI
Technical Specifications
Parameters and characteristics for this part
| Specification | 5CSEBA6U23C8SN |
|---|---|
| Architecture | FPGA, MCU |
| Connectivity | CANbus, SPI, I2C, UART/USART, MMC/SD/SDIO, Ethernet, EBI/EMI, USB OTG |
| Core Processor | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Number of I/O [custom] | 181 |
| Number of I/O [custom] | 145 |
| Operating Temperature [Max] | 85 °C |
| Operating Temperature [Min] | 0 °C |
| Package / Case | 672-FBGA |
| Peripherals | POR, WDT, DMA |
| Primary Attributes | 110K Logic Elements |
| RAM Size | 64 KB |
| Speed | 600 MHz |
| Supplier Device Package | 672-UBGA (23x23) |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | N/A | 0 | $ 215.07 | |
| 0 | $ 215.07 | |||
| Tray | 60 | $ 201.00 | ||
| 60 | $ 201.00 | |||
Description
General part information
5CSEBA6 Series
Single ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Cyclone® V SE FPGA - 110K Logic Elements 600MHz 672-UBGA (23x23)
Documents
Technical documentation and resources
