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RZL025P01TR
Discrete Semiconductor Products

RZL025P01TR

NRND
Rohm Semiconductor

MOSFET P-CH 12V 2.5A TUMT6

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RZL025P01TR
Discrete Semiconductor Products

RZL025P01TR

NRND
Rohm Semiconductor

MOSFET P-CH 12V 2.5A TUMT6

Technical Specifications

Parameters and characteristics for this part

SpecificationRZL025P01TR
Current - Continuous Drain (Id) @ 25°C2.5 A
Drain to Source Voltage (Vdss)12 V
Drive Voltage (Max Rds On, Min Rds On)1.5 V, 4.5 V
FET TypeP-Channel
Gate Charge (Qg) (Max) @ Vgs13 nC
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / Case6-SMD, Flat Leads
Power Dissipation (Max)1 W
Rds On (Max) @ Id, Vgs61 mOhm
Supplier Device PackageTUMT6
TechnologyMOSFET (Metal Oxide)
Vgs (Max)10 V
Vgs(th) (Max) @ Id1 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 2800$ 0.92

Description

General part information

RZL025P01 Series

MOSFETs are made as ultra-low ON-resistance by the micro-processing technologies suitable for mobile equipment for low current consumption. In wide lineup including compact type, high-power type and complex type to meet in the market.

Documents

Technical documentation and resources

What Is Thermal Design

Thermal Design

Types and Features of Transistors

Application Note

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Anti-Whisker formation - Transistors

Package Information

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

PCB Layout Thermal Design Guide

Thermal Design

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Inner Structure

Package Information

Taping Information

Package Information

How to Use LTspice® Models

Schematic Design & Verification

About Flammability of Materials

Environmental Data

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

List of Transistor Package Thermal Resistance

Thermal Design

How to Create Symbols for PSpice Models

Models

Condition of Soldering / Land Pattern Reference

Package Information

About Export Regulations

Export Information

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Part Explanation

Application Note

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Moisture Sensitivity Level - Transistors

Package Information

Compliance of the RoHS directive

Environmental Data

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

P-channel Power MOSFETs selection guide

Technical Article

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Reliability Test Result

Manufacturing Data

Explanation for Marking

Package Information

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

What is a Thermal Model? (Transistor)

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Two-Resistor Model for Thermal Simulation

Thermal Design

Package Dimensions

Package Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design