R7F701461EABG-C#HC0

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IC MCU 32BIT

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Integrated Circuits (ICs)

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IC MCU 32BIT

Technical Specifications

Parameters and characteristics for this part

Specification	R7F701461EABG-C#HC0

Connectivity	I2C, UART/USART, CSI, CANbus, Ethernet, LINbus
Core Processor	RH850G3M
Core Size	32-Bit
Data Converters	SAR
Data Converters	12 b
Data Converters [custom]	16
EEPROM Size	64 K
Grade	Automotive
Mounting Type	Surface Mount
Number of I/O	126
Operating Temperature [Max]	150 °C
Operating Temperature [Min]	-40 °C
Oscillator Type	Internal
Package / Case	272-BGA
Peripherals	Temp Sensor, DMA, WDT, I2S
Program Memory Size	4 MB
Program Memory Type	FLASH
Qualification	AEC-Q100
RAM Size	512 K
Speed	240 MHz
Supplier Device Package	272-BGA (21x21)
Voltage - Supply (Vcc/Vdd) [Max]	5.5 V
Voltage - Supply (Vcc/Vdd) [Min]	2.7 V

Part	Supplier Device Package	Grade	Voltage - Supply (Vcc/Vdd) [Min]	Voltage - Supply (Vcc/Vdd) [Max]	Speed	Program Memory Type	Peripherals	Number of I/O	Connectivity	Program Memory Size	Package / Case	Qualification	EEPROM Size	Operating Temperature [Max]	Operating Temperature [Min]	Oscillator Type	Core Processor	Core Size	Mounting Type	RAM Size	Data Converters	Data Converters	Data Converters [custom]
Renesas Electronics Corporation R7F701461EABG-C#HC0	272-BGA (21x21)	Automotive	2.7 V	5.5 V	240 MHz	FLASH	DMA I2S Temp Sensor WDT	126	CANbus CSI Ethernet I2C LINbus UART/USART	4 MB	272-BGA	AEC-Q100	64 K	150 °C	-40 °C	Internal	RH850G3M	32-Bit	Surface Mount	512 K	SAR	12 b	16

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

RH850G3M RH850/D1x Microcontroller IC 32-Bit 240MHz 4MB (4M x 8) FLASH 272-BGA (21x21)

Technical documentation and resources