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R6011KNXC7G
Discrete Semiconductor Products

R6011KNXC7G

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Rohm Semiconductor

600V 11A TO-220FM, HIGH-SPEED SWITCHING POWER MOSFET

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R6011KNXC7G
Discrete Semiconductor Products

R6011KNXC7G

Active
Rohm Semiconductor

600V 11A TO-220FM, HIGH-SPEED SWITCHING POWER MOSFET

Technical Specifications

Parameters and characteristics for this part

SpecificationR6011KNXC7G
Current - Continuous Drain (Id) @ 25°C11 A
Drain to Source Voltage (Vdss)600 V
Drive Voltage (Max Rds On, Min Rds On)10 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs [Max]22 nC
Input Capacitance (Ciss) (Max) @ Vds740 pF
Mounting TypeThrough Hole
Operating Temperature150 °C
Package / CaseTO-220-3 Full Pack
Power Dissipation (Max)53 W
Supplier Device PackageTO-220FM
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max) @ Id5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 680$ 3.47
NewarkEach 1$ 3.67
10$ 3.39
100$ 1.77
500$ 1.64
1000$ 1.54
3000$ 1.54
5000$ 1.53

Description

General part information

R6011KNX Series

R6011KNX is Low on-resistance and ultra fast switching speed Power MOSFET.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

Explanation for Marking

Package Information

Compliance of the RoHS directive

Environmental Data

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

ESD Data

Characteristics Data

List of Transistor Package Thermal Resistance

Thermal Design

About Export Regulations

Export Information

ROHM Solution Simulator Power Device User's Guide for Inverter

Simulations

Package Dimensions

Package Information

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

Anti-Whisker formation - Transistors

Package Information

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

What Is Thermal Design

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Part Explanation

Application Note

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

How to Create Symbols for PSpice Models

Models

About Flammability of Materials

Environmental Data

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Notes for Calculating Power Consumption:Static Operation

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Judgment Criteria of Thermal Evaluation

Thermal Design

How to Use LTspice&reg; Models

Schematic Design & Verification

Types and Features of Transistors

Application Note

Reliability Test Result

Manufacturing Data

Inner Structure

Package Information

Moisture Sensitivity Level - Transistors

Package Information

What is a Thermal Model? (Transistor)

Thermal Design